Kanji Hosoki

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Omiya, JP

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Patents Grantslast 30 patents

Information Patent Grant
Polishing apparatus, polishing method and method of conditioning po...
- Patent number 6,488,573
- Issue date Dec 3, 2002
- Mitsubishi Materials Corporation
- Tatsunori Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for dressing a wafer polishing pad
- Patent number 6,302,772
- Issue date Oct 16, 2001
- Mitsubishi Materials Corporation
- Kanji Hosoki
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing apparatus and wafer manufacturing method
- Patent number 6,280,306
- Issue date Aug 28, 2001
- Mitsubishi Materials Corporation
- Kanji Hosoki
- B24 - GRINDING POLISHING