Kanji Nishijima

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of metal-plating electrode portions of printed-wiring board
- Patent number 5,766,492
- Issue date Jun 16, 1998
- Nippon Paint Co., Ltd.
- Toshiya Sadahisa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming resist pattern by irradiating a resist coating o...
- Patent number 5,683,857
- Issue date Nov 4, 1997
- Nippon Paint Co., Ltd.
- Masamitsu Shirai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of treating an electrodeposited photosensitive resist to red...
- Patent number 5,474,666
- Issue date Dec 12, 1995
- Nippon Paint Co., Ltd.
- Mamoru Seio
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for forming a resist pattern
- Patent number 5,278,029
- Issue date Jan 11, 1994
- Nippon Paint Co., Ltd.
- Masamitsu Shirai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Positive type, photosensitive resinous composition
- Patent number 5,213,946
- Issue date May 25, 1993
- Nippon Paint Co., Ltd.
- Masamitsu Shirai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electrodeposition coating composition and image-forming method usin...
- Patent number 5,166,036
- Issue date Nov 24, 1992
- Nippon Paint Co., Ltd.
- Mamoru Seio
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electrodeposition coating composition containing an acrylic resin a...
- Patent number 5,055,374
- Issue date Oct 8, 1991
- Nippon Paint Co., Ltd.
- Mamoru Seio
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Positive type photosensitive resinous composition with 1,2 quinone...
- Patent number 4,999,274
- Issue date Mar 12, 1991
- Nippon Paint Co., Ltd.
- Mamoru Seio
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Positive type 1,2 quinone diazide containing photosensitive resinou...
- Patent number 4,946,757
- Issue date Aug 7, 1990
- Nippon Paint Co., Ltd.
- Mamoru Seio
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for preparing a printed circuit board
- Patent number RE33108
- Issue date Nov 7, 1989
- Nippon Paint Co., Ltd.
- Katsukiyo Ishikawa
- 156 - Adhesive bonding and miscellaneous chemical manufacture
Information Patent Grant
Positive type photosensitive resinous composition
- Patent number 4,869,995
- Issue date Sep 26, 1989
- Nippon Paint Co., Ltd.
- Masamitsu Shirai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for preparing a printed circuit board
- Patent number 4,673,458
- Issue date Jun 16, 1987
- Nippon Paint Co., Ltd.
- Katsukiyo Ishikawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for preparing a printed circuit board with solder plated cir...
- Patent number 4,671,854
- Issue date Jun 9, 1987
- Nippon Paint Co., Ltd.
- Katsukiyo Ishikawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Kanji Nishijima

Person

Patents Grantslast 30 patents

Method of metal-plating electrode portions of printed-wiring board

Method for forming resist pattern by irradiating a resist coating o...

Method of treating an electrodeposited photosensitive resist to red...

Method for forming a resist pattern

Positive type, photosensitive resinous composition

Electrodeposition coating composition and image-forming method usin...

Electrodeposition coating composition containing an acrylic resin a...

Positive type photosensitive resinous composition with 1,2 quinone...

Positive type 1,2 quinone diazide containing photosensitive resinou...

Method for preparing a printed circuit board

Positive type photosensitive resinous composition

Method for preparing a printed circuit board

Method for preparing a printed circuit board with solder plated cir...