Kanji Ohno

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Sagamihara, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate plating method and apparatus
- Patent number 6,908,534
- Issue date Jun 21, 2005
- Ebara Corporation
- Akihisa Hongo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for forming interconnects
- Patent number 6,811,658
- Issue date Nov 2, 2004
- Ebara Corporation
- Akihisa Hongo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for plating a first layer on a substrate and a second layer...
- Patent number 6,517,894
- Issue date Feb 11, 2003
- Ebara Corporation
- Akihisa Hongo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making alkanol-or alkane-sulfone plumbate
- Patent number 6,242,624
- Issue date Jun 5, 2001
- Ebara Corporation
- Junichiro Yoshioka
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
Substrate plating method and apparatus
- Publication number 20050098439
- Publication date May 12, 2005
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for forming interconnects, and polishing liqui...
- Publication number 20040200728
- Publication date Oct 14, 2004
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for forming interconnects, and polishing liqui...
- Publication number 20020088709
- Publication date Jul 11, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate plating method and apparatus
- Publication number 20020064591
- Publication date May 30, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR