Kaoru Kawai

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Kanagawa-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 6,960,494
- Issue date Nov 1, 2005
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 6,836,012
- Issue date Dec 28, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20050051810
- Publication date Mar 10, 2005
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030183946
- Publication date Oct 2, 2003
- Masatoshi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of manufacturing the same
- Publication number 20020140095
- Publication date Oct 3, 2002
- Kabushiki Kaisha Toshiba
- Hiroshi Funakura
- H01 - BASIC ELECTRIC ELEMENTS