Kapil H. Sahasrabudhe

Person

Farmers Branch, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Leadframe having delamination resistant die pad
- Patent number 8,154,109
- Issue date Apr 10, 2012
- Texas Instruments Incorporated
- Kapil H Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bumps as local heat sinks during transient power operations
- Patent number 8,129,224
- Issue date Mar 6, 2012
- Texas Instruments Incorporated
- Siva P Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip attach configuration having improved thermal cha...
- Patent number 8,102,038
- Issue date Jan 24, 2012
- Texas Instruments Incorporated
- Kapil Heramb Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bumps as local heat sinks during transient power operations
- Patent number 7,838,988
- Issue date Nov 23, 2010
- Texas Instruments Incorporated
- Siva Prakash Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having delamination resistant die pad
- Patent number 7,821,113
- Issue date Oct 26, 2010
- Texas Instruments Incorporated
- Kapil Heramb Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR
- Publication number 20240404929
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask-Less Selective Plating of Leadframe
- Publication number 20170051388
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Mask-Less Selective Plating of Leadframes
- Publication number 20130025745
- Publication date Jan 31, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Chip Attach Configuration Having Improved Thermal Cha...
- Publication number 20120094441
- Publication date Apr 19, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Heramb SAHASRABUDHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Attach Configuration Having Improved Thermal Cha...
- Publication number 20110068446
- Publication date Mar 24, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Heramb SAHASRABUDHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe Having Delamination Resistant Die Pad
- Publication number 20110012243
- Publication date Jan 20, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Heramb SAHASRABUDHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMPS AS LOCAL HEAT SINKS DURING TRANSIENT POWER OPERATIONS
- Publication number 20100301470
- Publication date Dec 2, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Siva P. Gurrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME HAVING DELAMINATION RESISTANT DIE PAD
- Publication number 20090294932
- Publication date Dec 3, 2009
- Texas Instruments Inc.
- Kapil Heramb Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS

Kapil H. Sahasrabudhe

Person

Patents Grantslast 30 patents

Leadframe having delamination resistant die pad

Stud bumps as local heat sinks during transient power operations

Semiconductor chip attach configuration having improved thermal cha...

Stud bumps as local heat sinks during transient power operations

Leadframe having delamination resistant die pad

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR

Mask-Less Selective Plating of Leadframe

Mask-Less Selective Plating of Leadframes

Semiconductor Chip Attach Configuration Having Improved Thermal Cha...

Semiconductor Chip Attach Configuration Having Improved Thermal Cha...

Leadframe Having Delamination Resistant Die Pad

STUD BUMPS AS LOCAL HEAT SINKS DURING TRANSIENT POWER OPERATIONS

LEADFRAME HAVING DELAMINATION RESISTANT DIE PAD