Karen L. Holloway

Person

Bronx, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for providing rotationally symmetric alignment marks for an...
- Patent number 8,039,366
- Issue date Oct 18, 2011
- International Business Machines Corporation
- Karen L. Holloway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process-robust alignment mark structure for semiconductor wafers
- Patent number 6,803,668
- Issue date Oct 12, 2004
- International Business Machines Corporation
- Karen L. Holloway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
‘Via first’ dual damascene process for copper metal...
- Patent number 6,576,550
- Issue date Jun 10, 2003
- Infineon, AG
- Gabriela Brase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable data compensation for vias or contacts
- Patent number 6,461,877
- Issue date Oct 8, 2002
- International Business Machines Corporation
- Karen L. Holloway
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Copper alloy metallurgies for VLSI interconnection structures
- Patent number 5,243,222
- Issue date Sep 7, 1993
- International Business Machines Corporation
- James M. E. Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy metallurgies for VLSI interconnection structures
- Patent number 5,130,274
- Issue date Jul 14, 1992
- International Business Machines Corporation
- James M. E. Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning of polyimide films with far ultraviolet light
- Patent number 4,568,632
- Issue date Feb 4, 1986
- International Business Machines Corporation
- Samuel E. Blum
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PROVIDING ROTATIONALLY SYMMETRIC ALIGNMENT MARKS FOR AN...
- Publication number 20100207284
- Publication date Aug 19, 2010
- International Business Machines Corporation
- Karen L. Holloway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process-robust alignment mark structure for semiconductor wafers
- Publication number 20040099963
- Publication date May 27, 2004
- International Business Machines Corporation
- Karen L. Holloway
- H01 - BASIC ELECTRIC ELEMENTS

Karen L. Holloway

Person

Patents Grantslast 30 patents

Method for providing rotationally symmetric alignment marks for an...

Process-robust alignment mark structure for semiconductor wafers

&#x02018;Via first&#x02019; dual damascene process for copper metal...

Variable data compensation for vias or contacts

Copper alloy metallurgies for VLSI interconnection structures

Copper alloy metallurgies for VLSI interconnection structures

Patterning of polyimide films with far ultraviolet light

Patents Applicationslast 30 patents

METHOD FOR PROVIDING ROTATIONALLY SYMMETRIC ALIGNMENT MARKS FOR AN...

Process-robust alignment mark structure for semiconductor wafers

‘Via first’ dual damascene process for copper metal...