This is a divisional of copending application Ser. No. 681,798, filed on Apr. 5, 1991 now U.S. Pat. No. 5,130,274.
Number | Name | Date | Kind |
---|---|---|---|
3631304 | Bhatt | Dec 1971 | |
4566177 | van de Ven et al. | Jan 1986 | |
4720908 | Wills | Jan 1988 | |
4784973 | Stevens et al. | Nov 1988 | |
4805009 | Pryor et al. | Feb 1989 | |
4816425 | McPherson | Mar 1989 | |
4827326 | Altman et al. | May 1989 | |
4843453 | Hooper et al. | Jun 1989 | |
4866008 | Brighton et al. | Sep 1989 | |
4884123 | Dixit et al. | Nov 1989 | |
4910169 | Hoshino | Mar 1990 | |
4916509 | Blanchard et al. | Apr 1990 | |
4985750 | Hoshino | Jan 1991 | |
4996584 | Young et al. | Feb 1991 |
Number | Date | Country |
---|---|---|
0061593 | Oct 1982 | EPX |
0261846 | Mar 1988 | EPX |
0335383 | Oct 1989 | EPX |
0421735 | Apr 1991 | EPX |
55-107257 | Aug 1980 | JPX |
59-43570 | Oct 1984 | JPX |
60-7162 | Jan 1985 | JPX |
62-113421 | May 1987 | JPX |
2-50432 | Feb 1990 | JPX |
Entry |
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Chang, C. A., "Ta as a Barrier for the Cu/PtSi, Cu/Si and Al/PtSi Structures," J. of Vacuum Science & Technology A, vol. 8, No. 5, pp. 3796-3802 (1990). |
Towner, J. M., et al., "Effects of Vanadium and Chromium on Aluminum Electromigration", J. Appl. Phys., 61(4):1392 (1987). |
d'Heurle, F. M., et al., "Improving the Lifetime of Aluminum Films", IBM Technical Disclosure Bulletin, 13(12):3793 (1971). |
Ames, I., et al., "Copper-Doped Aluminum Stripes", IBM Technical Disclosure Bulletin, 13(7):1748 (1970). |
Number | Date | Country | |
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Parent | 681798 | Apr 1991 |