Karl G. Hoebener

Person

Georgetown, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder ball connections and assembly process
- Patent number 6,504,105
- Issue date Jan 7, 2003
- International Business Machines Corporation
- John Acocella
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Print circuit board product with stencil controlled fine pitch sold...
- Patent number 5,825,629
- Issue date Oct 20, 1998
- International Business Machines Corporation
- Karl Grant Hoebener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming bumps on a substrate
- Patent number 5,762,259
- Issue date Jun 9, 1998
- Motorola Inc.
- Eric M. Hubacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a multiple layer circuit board die carrier...
- Patent number 5,758,413
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Ku Ho Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine dimension stacked vias for a multiple layer circuit board stru...
- Patent number 5,699,613
- Issue date Dec 23, 1997
- International Business Machines Corporation
- Ku Ho Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball connections and assembly process
- Patent number 5,675,889
- Issue date Oct 14, 1997
- International Business Machines Corporation
- John Acocella
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball interconnected assembly
- Patent number 5,591,941
- Issue date Jan 7, 1997
- International Business Machines Corporation
- John Acocella
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch solder deposits on printed circuit board process and pro...
- Patent number 5,492,266
- Issue date Feb 20, 1996
- International Business Machines Corporation
- Karl G. Hoebener
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection structure and test method
- Patent number 5,147,084
- Issue date Sep 15, 1992
- International Business Machines Corporation
- John R. Behun
- G01 - MEASURING TESTING
Information Patent Grant
Interconnection structure and test method
- Patent number 5,060,844
- Issue date Oct 29, 1991
- International Business Machines Corporation
- John R. Behun
- G01 - MEASURING TESTING
Information Patent Grant
Method of attaching electronic components
- Patent number 4,998,342
- Issue date Mar 12, 1991
- International Business Machines Corporation
- Ralph E. Bonnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder deposition control
- Patent number 4,919,970
- Issue date Apr 24, 1990
- International Business Machines Corporation
- Karl G. Hoebener
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single step solder process
- Patent number 4,761,881
- Issue date Aug 9, 1988
- International Business Machines Corporation
- Muhammad-Yusuf J. Bora
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Karl G. Hoebener

Person

Patents Grantslast 30 patents

Solder ball connections and assembly process

Print circuit board product with stencil controlled fine pitch sold...

Method for forming bumps on a substrate

Method of manufacturing a multiple layer circuit board die carrier...

Fine dimension stacked vias for a multiple layer circuit board stru...

Solder ball connections and assembly process

Solder ball interconnected assembly

Fine pitch solder deposits on printed circuit board process and pro...

Interconnection structure and test method

Interconnection structure and test method

Method of attaching electronic components

Solder deposition control

Single step solder process