Number | Name | Date | Kind |
---|---|---|---|
4673773 | Nakano et al. | Jun 1987 | |
4908940 | Amano et al. | Mar 1990 | |
5006182 | Gantzhorn, Jr. et al. | Apr 1991 | |
5098771 | Friend | Mar 1992 | |
5123849 | Deak et al. | Jun 1992 | |
5129142 | Bindra et al. | Jul 1992 | |
5200112 | Angelopooulos et al. | Apr 1993 | |
5232548 | Ehrenberg et al. | Aug 1993 | |
5263243 | Taneda et al. | Nov 1993 | |
5300402 | Card, Jr. et al. | Apr 1994 | |
5327013 | Moore et al. | Jul 1994 | |
5346558 | Mathias | Sep 1994 | |
5376403 | Capote et al. | Dec 1994 | |
5378402 | Cross et al. | Jan 1995 | |
5487218 | Bhatt et al. | Jan 1996 | |
5509203 | Yamashita | Apr 1996 |
Number | Date | Country |
---|---|---|
406164149 | Jun 1994 | JPX |
40620664 | Jul 1994 | JPX |
Entry |
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IBM Technical Disclosure Bulletin, vol. 36, No. 05, May 1993, "Method of Adding Devices to a Finished Circuit Card or Panel", p. 207. |
IBM Technical Disclosure Bulletin, vol. 4, No. 2, Jul. 1961, "Solderable Contact Adhesive", pp. 15-16. |
VLSI Technology, S. M. Sze, 1983, pp. 554-555. |