Karl Mayer

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Component and method of manufacturing a component using an ultrathi...
- Patent number 11,367,654
- Issue date Jun 21, 2022
- Infineon Technologies AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method of manufacturing a component using an ultrathi...
- Patent number 10,186,458
- Issue date Jan 22, 2019
- Infineon Technologies AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a semiconductor workpiece
- Patent number 10,157,765
- Issue date Dec 18, 2018
- Infineon Technologies AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a wafer and wafer structure
- Patent number 9,935,060
- Issue date Apr 3, 2018
- Infineon Technologies AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods for manufacturing a chip package
- Patent number 9,666,452
- Issue date May 30, 2017
- Infineon Technologies AG
- Karl Adolf Dieter Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a wafer and wafer structure
- Patent number 9,589,880
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Utilization of a metallization scheme as an etching mask
- Patent number 8,772,133
- Issue date Jul 8, 2014
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a contact pad
- Patent number 8,603,910
- Issue date Dec 10, 2013
- Infineon Technologies AG
- Marco Koitz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Component and Method of Manufacturing a Component Using an Ultrathi...
- Publication number 20220246475
- Publication date Aug 4, 2022
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component and Method of Manufacturing a Component Using an Ultrathi...
- Publication number 20190148233
- Publication date May 16, 2019
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A WAFER AND WAFER STRUCTURE
- Publication number 20170154857
- Publication date Jun 1, 2017
- INFINEON TECHNOLOGIES AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20170076970
- Publication date Mar 16, 2017
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lithium Ion Battery, Integrated Circuit and Method of Manufacturing...
- Publication number 20150280288
- Publication date Oct 1, 2015
- INFINEON TECHNOLOGIES AG
- Vijaye Kumar Rajaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE
- Publication number 20150147850
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Gudrun Stranzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A WAFER AND WAFER STRUCTURE
- Publication number 20150097294
- Publication date Apr 9, 2015
- INFINEON TECHNOLOGIES AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component and Method of Manufacturing a Component Using an Ultrathi...
- Publication number 20140008805
- Publication date Jan 9, 2014
- INFINEON TECHNOLOGIES AG
- Karl Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UTILIZATION OF A METALLIZATION SCHEME AS AN ETCHING MASK
- Publication number 20130328195
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES AND METHODS FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20130313719
- Publication date Nov 28, 2013
- INFINEON TECHNOLOGIES AG
- Karl Adolf Dieter MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A CONTACT PAD
- Publication number 20130180945
- Publication date Jul 18, 2013
- INFINEON TECHNOLOGIES AG
- Marco Koitz
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Component and method of manufacturing a component using an ultrathi...

Component and method of manufacturing a component using an ultrathi...

Methods for processing a semiconductor workpiece

Method for processing a wafer and wafer structure

Chip packages and methods for manufacturing a chip package

Method for processing a wafer and wafer structure

Utilization of a metallization scheme as an etching mask

Method of processing a contact pad

Patents Applicationslast 30 patents

Component and Method of Manufacturing a Component Using an Ultrathi...

Component and Method of Manufacturing a Component Using an Ultrathi...

METHOD FOR PROCESSING A WAFER AND WAFER STRUCTURE

METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE

Lithium Ion Battery, Integrated Circuit and Method of Manufacturing...

METHODS FOR PROCESSING A SEMICONDUCTOR WORKPIECE

METHOD FOR PROCESSING A WAFER AND WAFER STRUCTURE

Component and Method of Manufacturing a Component Using an Ultrathi...

UTILIZATION OF A METALLIZATION SCHEME AS AN ETCHING MASK

CHIP PACKAGES AND METHODS FOR MANUFACTURING A CHIP PACKAGE

METHOD OF PROCESSING A CONTACT PAD