Karthik Shanmugam

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Molded silicon on passive package
- Patent number 12,165,956
- Issue date Dec 10, 2024
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible package architecture concept in fanout
- Patent number 12,074,077
- Issue date Aug 27, 2024
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package integration using fanout cavity substrate
- Patent number 11,532,563
- Issue date Dec 20, 2022
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple component integration in fanout package with different bac...
- Patent number 11,515,261
- Issue date Nov 29, 2022
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level passive array packaging
- Patent number 11,395,408
- Issue date Jul 19, 2022
- Apple Inc.
- Scott D. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level optical module
- Patent number 10,993,317
- Issue date Apr 27, 2021
- Apple Inc.
- Yinjuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level optical module
- Patent number 10,811,400
- Issue date Oct 20, 2020
- Apple Inc.
- Yinjuan He
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic Package Molded Vertical Interconnection
- Publication number 20250096096
- Publication date Mar 20, 2025
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Silicon on Passive Package
- Publication number 20230178458
- Publication date Jun 8, 2023
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Package Architecture Concept in Fanout
- Publication number 20220157680
- Publication date May 19, 2022
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INTEGRATION USING FANOUT CAVITY SUBSTRATE
- Publication number 20220093522
- Publication date Mar 24, 2022
- Apple Inc.
- Karthik Shanmugam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPLE COMPONENT INTEGRATION IN FANOUT PACKAGE WITH DIFFERENT BAC...
- Publication number 20220093523
- Publication date Mar 24, 2022
- Apple Inc.
- Karthik Shanmugam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer-Level Passive Array Packaging
- Publication number 20220071013
- Publication date Mar 3, 2022
- Apple Inc.
- Scott D. Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL OPTICAL MODULE
- Publication number 20200107436
- Publication date Apr 2, 2020
- Apple Inc.
- Yinjuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL OPTICAL MODULE
- Publication number 20200107435
- Publication date Apr 2, 2020
- Apple Inc.
- Yinjuan He
- H01 - BASIC ELECTRIC ELEMENTS

Karthik Shanmugam

Person

Patents Grantslast 30 patents

Molded silicon on passive package

Flexible package architecture concept in fanout

Package integration using fanout cavity substrate

Multiple component integration in fanout package with different bac...

Wafer-level passive array packaging

Wafer level optical module

Wafer level optical module

Patents Applicationslast 30 patents

Electronic Package Molded Vertical Interconnection

Molded Silicon on Passive Package

Flexible Package Architecture Concept in Fanout

PACKAGE INTEGRATION USING FANOUT CAVITY SUBSTRATE

MULTIPLE COMPONENT INTEGRATION IN FANOUT PACKAGE WITH DIFFERENT BAC...

Wafer-Level Passive Array Packaging

WAFER LEVEL OPTICAL MODULE

WAFER LEVEL OPTICAL MODULE