Kasemsan Kongthaworn

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Patumthani, TH

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip leadframe semiconductor package
- Patent number 8,816,482
- Issue date Aug 26, 2014
- United Test & Assembly Center Ltd.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame land grid array with routing connector trace under unit
- Patent number 8,685,794
- Issue date Apr 1, 2014
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame ball grid array with traces under die
- Patent number 8,652,879
- Issue date Feb 18, 2014
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame ball grid array with traces under die
- Patent number 8,492,906
- Issue date Jul 23, 2013
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame land grid array with routing connector trace under unit
- Patent number 8,487,451
- Issue date Jul 16, 2013
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT
- Publication number 20130337609
- Publication date Dec 19, 2013
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME BALL GRID ARRAY WITH TRACES UNDER DIE
- Publication number 20130280866
- Publication date Oct 24, 2013
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME BALL GRID ARRAY WITH TRACES UNDER DIE
- Publication number 20110198752
- Publication date Aug 18, 2011
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT
- Publication number 20110147931
- Publication date Jun 23, 2011
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP LEADFRAME SEMICONDUCTOR PACKAGE
- Publication number 20090146276
- Publication date Jun 11, 2009
- United Test and Assembly Center, Ltd.
- Saravuth SIRINORAKUL
- H01 - BASIC ELECTRIC ELEMENTS