Kathy Yan

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal module for a semiconductor package and methods of forming t...
- Patent number 12,362,258
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES
- Publication number 20250239514
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cong-Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MOR...
- Publication number 20250233047
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK STRUCTURE AND METHODS THEREOF
- Publication number 20250227884
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hao HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE
- Publication number 20250221310
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING DEVICE SUBSTRATE, METHOD FOR FORMING PACKAGE STR...
- Publication number 20250218986
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Structure with Thermelectric Self-Coolin...
- Publication number 20250218895
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250210420
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bang Li Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20250210458
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250201658
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
- Publication number 20250201652
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD...
- Publication number 20250201651
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
- Publication number 20250201668
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167104
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR FORMING DEVICES WITH LIDS
- Publication number 20250132223
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Shiou Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250112137
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS
- Publication number 20250096071
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsunyen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL...
- Publication number 20240395770
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Thermal Module
- Publication number 20240395663
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sing-Da JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...
- Publication number 20240387321
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID WITH A VAPOR CHAMBER BASE HAVING AN ANGLED PORTION AND...
- Publication number 20240274504
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240145433
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturiing Co., Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240128148
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROG...
- Publication number 20240063087
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Liang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...
- Publication number 20240055321
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thermal module for a semiconductor package and methods of forming t...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH REINFORCEMENT STRUCTURES

PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MOR...

HEAT SINK STRUCTURE AND METHODS THEREOF

ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE

METHOD FOR FORMING DEVICE SUBSTRATE, METHOD FOR FORMING PACKAGE STR...

Integrated Circuit Package Structure with Thermelectric Self-Coolin...

INTEGRATED CIRCUIT PACKAGES AND METHODS

THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED THERMAL SOLUTION AND METHOD...

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID

SEMICONDUCTOR PACKAGE

DEVICES AND METHODS FOR FORMING DEVICES WITH LIDS

INTEGRATED CIRCUIT PACKAGE AND METHOD

INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS

METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL...

Semiconductor Device Package with Thermal Module

THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...

PACKAGE LID WITH A VAPOR CHAMBER BASE HAVING AN ANGLED PORTION AND...

INTEGRATED CIRCUIT PACKAGE AND METHOD

Integrated Circuit Packages and Methods of Forming the Same

THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROG...

THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...