Katsuaki Kojima

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Nagoya, JP

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Patents Grantslast 30 patents

Information Patent Grant
Interconnection structure for interconnecting printed circuit boards
- Patent number 6,784,375
- Issue date Aug 31, 2004
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and bonding structure of thermoplastic resin material
- Patent number 6,605,357
- Issue date Aug 12, 2003
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for interconnecting printed circuit boards and interconnecti...
- Patent number 6,449,836
- Issue date Sep 17, 2002
- Denso Corporation
- Toshihiro Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless copper plating solution and process for formation of co...
- Patent number 5,965,211
- Issue date Oct 12, 1999
- Nippondenso Co., Ltd.
- Koji Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution and process for formation of co...
- Patent number 5,039,338
- Issue date Aug 13, 1991
- Nippondenso Co. Ltd.
- Koji Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method for interconnecting printed circuit boards and interconnecti...
- Publication number 20020189862
- Publication date Dec 19, 2002
- Toshihiro Miyake
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC