Katsuhiko Watanabe

Person

Moriguchi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding tool and electronic component mounting apparatus and method
- Patent number 8,328,066
- Issue date Dec 11, 2012
- Panasonic Corporation
- Ryo Fujita
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding tool, electronic component mounting apparatus and electroni...
- Patent number 8,028,886
- Issue date Oct 4, 2011
- Panasonic Corporation
- Hiroshi Ebihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting head, and apparatus and method for mo...
- Patent number 7,980,444
- Issue date Jul 19, 2011
- Panasonic Corporation
- Hiroshi Ebihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting apparatus and electronic component mo...
- Patent number 7,850,056
- Issue date Dec 14, 2010
- Panasonic Corporation
- Hiroshi Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting apparatus and electronic component mo...
- Patent number 7,789,284
- Issue date Sep 7, 2010
- Panasonic Corporation
- Hiroshi Ebihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting apparatus and electronic component mo...
- Patent number 7,246,430
- Issue date Jul 24, 2007
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Yonezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for bonding electronic component, circuit boar...
- Patent number 6,995,342
- Issue date Feb 7, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for bonding electronic component, circuit boar...
- Patent number 6,797,926
- Issue date Sep 28, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING TOOL AND ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD
- Publication number 20100219229
- Publication date Sep 2, 2010
- PANASONIC CORPORATION
- Ryo FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL, ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONI...
- Publication number 20100140326
- Publication date Jun 10, 2010
- PANASONIC CORPORATION
- Hiroshi Ebihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MO...
- Publication number 20100065613
- Publication date Mar 18, 2010
- PANASONIC CORPORATION
- Hiroshi Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MO...
- Publication number 20090277951
- Publication date Nov 12, 2009
- PANASONIC CORPORATION
- Hiroshi EBIHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component Mounting Head, and Apparatus and Method for Mo...
- Publication number 20090265924
- Publication date Oct 29, 2009
- Hiroshi Ebihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounting apparatus and electronic component mo...
- Publication number 20050071991
- Publication date Apr 7, 2005
- Takahiro Yonezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for bonding electronic component, circuit boar...
- Publication number 20050011934
- Publication date Jan 20, 2005
- Hiroshi Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for bonding electronic component, circuit boar...
- Publication number 20030080108
- Publication date May 1, 2003
- Hiroshi Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Katsuhiko Watanabe

Person

Patents Grantslast 30 patents

Bonding tool and electronic component mounting apparatus and method

Bonding tool, electronic component mounting apparatus and electroni...

Electronic component mounting head, and apparatus and method for mo...

Electronic component mounting apparatus and electronic component mo...

Electronic component mounting apparatus and electronic component mo...

Electronic component mounting apparatus and electronic component mo...

Apparatus and method for bonding electronic component, circuit boar...

Apparatus and method for bonding electronic component, circuit boar...

Patents Applicationslast 30 patents

BONDING TOOL AND ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD

BONDING TOOL, ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONI...

ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MO...

ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MO...

Electronic Component Mounting Head, and Apparatus and Method for Mo...

Electronic component mounting apparatus and electronic component mo...

Apparatus and method for bonding electronic component, circuit boar...

Apparatus and method for bonding electronic component, circuit boar...