Katsuhiro Itakura

Person

Itami-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer holding body
- Patent number 12,033,880
- Issue date Jul 9, 2024
- Sumitomo Electric Industries, Ltd.
- Koichi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer holding unit
- Patent number 10,886,157
- Issue date Jan 5, 2021
- Sumitomo Electric Industries, Ltd.
- Koichi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer holder for wafer prober and wafer prober equipped with the same
- Patent number 7,855,569
- Issue date Dec 21, 2010
- Sumitomo Electric Industries, Ltd.
- Masuhiro Natsuhara
- G01 - MEASURING TESTING
Information Patent Grant
Wafer holder, and wafer prober provided therewith
- Patent number 7,576,303
- Issue date Aug 18, 2009
- Sumitomo Electric Industries, Ltd.
- Masuhiro Natsuhara
- G01 - MEASURING TESTING
Information Patent Grant
Body for keeping a wafer, heater unit and wafer prober
- Patent number 7,495,460
- Issue date Feb 24, 2009
- Sumitomo Electric Industries, Ltd.
- Katsuhiro Itakura
- G01 - MEASURING TESTING
Information Patent Grant
Body for keeping a wafer and wafer prober using the same
- Patent number 7,425,838
- Issue date Sep 16, 2008
- Sumitomo Electric Industries, Ltd.
- Katsuhiro Itakura
- G01 - MEASURING TESTING
Information Patent Grant
Saw device
- Patent number 6,984,918
- Issue date Jan 10, 2006
- Seiko Epson Corporation
- Akihiro Hachigo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for separating chips from diamond wafer
- Patent number 6,805,808
- Issue date Oct 19, 2004
- Sumitomo Electric Industries, Ltd.
- Satoshi Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface acoustic wave element
- Patent number 6,713,941
- Issue date Mar 30, 2004
- Seiko Epson Corporation
- Katsuhiro Itakura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device utilizing a ZnO layer and a diamond layer
- Patent number 6,642,813
- Issue date Nov 4, 2003
- Sumitomo Electric Industries, Ltd.
- Katsuhiro Itakura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device
- Patent number 6,469,416
- Issue date Oct 22, 2002
- Sumitomo Electric Industries, Ltd.
- Katsuhiro Itakura
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
HEATER
- Publication number 20240098847
- Publication date Mar 21, 2024
- Sumitomo Electric Industries, Ltd.
- Koichi KIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER HOLDING BODY
- Publication number 20210074568
- Publication date Mar 11, 2021
- Sumitomo Electric Industries, Ltd.
- Koichi KIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER HOLDING UNIT
- Publication number 20180174878
- Publication date Jun 21, 2018
- Sumitomo Electric Industries, Ltd.
- Koichi KIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEATER UNIT, HEATING AND COOLING DEVICE, AND APPARATUS COMPRISING SAME
- Publication number 20110139399
- Publication date Jun 16, 2011
- Sumitomo Electric Industries, Ltd.
- Katsuhiro ITAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer holder, heater unit used for wafer prober having the wafer ho...
- Publication number 20090050621
- Publication date Feb 26, 2009
- Tomoyuki Awazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer holder for wafer prober and wafer prober equipped with same
- Publication number 20090045829
- Publication date Feb 19, 2009
- Sumitomo Electric Industries, Ltd.
- Tomoyuki Awazu
- G01 - MEASURING TESTING
Information Patent Application
Wafer holder, heater unit used for wafer prober and having wafer ho...
- Publication number 20080211526
- Publication date Sep 4, 2008
- Kenji Shinma
- G01 - MEASURING TESTING
Information Patent Application
Wafer holder, and wafer prober provided therewith
- Publication number 20070205788
- Publication date Sep 6, 2007
- Sumitomo Electric Industries, Ltd.
- Masuhiro Natsuhara
- G01 - MEASURING TESTING
Information Patent Application
Wafer holder, and heater unit and wafer prober provided therewith
- Publication number 20070205787
- Publication date Sep 6, 2007
- Sumitomo Electric Industries, Ltd.
- Masuhiro Natsuhara
- G01 - MEASURING TESTING
Information Patent Application
Wafer holder, and wafer prober and semiconductor manufacturing appa...
- Publication number 20070182433
- Publication date Aug 9, 2007
- Sumitomo Electric Industries, Ltd.
- Masuhiro Natsuhara
- G01 - MEASURING TESTING
Information Patent Application
Wafer holder, and heating unit and wafer prober provided with the w...
- Publication number 20070126457
- Publication date Jun 7, 2007
- Sumitomo Electric Industries, Ltd.
- Masuhiro Natsuhara
- G01 - MEASURING TESTING
Information Patent Application
Wafer holder, heater unit having the wafer holder, and wafer prober...
- Publication number 20070082313
- Publication date Apr 12, 2007
- Katsuhiro Itakura
- G01 - MEASURING TESTING
Information Patent Application
Heating unit and wafer prober having the same
- Publication number 20070056952
- Publication date Mar 15, 2007
- Katsuhiro Itakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer holder, heater unit used for wafer prober having the wafer ho...
- Publication number 20070045778
- Publication date Mar 1, 2007
- Katsuhiro Itakura
- G01 - MEASURING TESTING
Information Patent Application
Wafer holder and wafer prober having the same
- Publication number 20070046305
- Publication date Mar 1, 2007
- Tomoyuki Awazu
- G01 - MEASURING TESTING
Information Patent Application
Wafer holder, heater unit having the wafer holder, and wafer prober...
- Publication number 20070046306
- Publication date Mar 1, 2007
- Tomoyuki Awazu
- G01 - MEASURING TESTING
Information Patent Application
Body for keeping a wafer, heater unit and wafer prober
- Publication number 20070046307
- Publication date Mar 1, 2007
- Katsuhiro Itakura
- G01 - MEASURING TESTING
Information Patent Application
Wafer holder for wafer prober and wafer prober equipped with same
- Publication number 20070028834
- Publication date Feb 8, 2007
- Sumitomo Electric Industries, Ltd.
- Tomoyuki Awazu
- G01 - MEASURING TESTING
Information Patent Application
Body for keeping a wafer, method of manufacturing the same and devi...
- Publication number 20070029740
- Publication date Feb 8, 2007
- Masuhiro Natsuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Body for keeping a wafer and wafer prober using the same
- Publication number 20070024299
- Publication date Feb 1, 2007
- Katsuhiro Itakura
- G01 - MEASURING TESTING
Information Patent Application
Chuck top, wafer holder having the chuck top, and wafer prober havi...
- Publication number 20070024313
- Publication date Feb 1, 2007
- Katsuhiro Itakura
- G01 - MEASURING TESTING
Information Patent Application
Wafer holder, heater unit used for wafer prober and having wafer ho...
- Publication number 20070024304
- Publication date Feb 1, 2007
- Katsuhiro Itakura
- G01 - MEASURING TESTING
Information Patent Application
Wafer holder for wafer prober and wafer prober equipped with the same
- Publication number 20060186904
- Publication date Aug 24, 2006
- Sumitomo Electric Industries, Ltd.
- Masuhiro Natsuhara
- G01 - MEASURING TESTING
Information Patent Application
Solder film manufacturing method, heat sink furnished with solder f...
- Publication number 20060057404
- Publication date Mar 16, 2006
- Sumitomo Electric Industries, Ltd.
- Katsuhiro Itakura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder film manufacturing method, heat sink furnished with solder f...
- Publication number 20050089700
- Publication date Apr 28, 2005
- Sumitomo Electric Industries, Ltd.
- Katsuhiro Itakura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for separating chips from diamond wafer
- Publication number 20030127428
- Publication date Jul 10, 2003
- Satoshi Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface acoustic wave element
- Publication number 20030011281
- Publication date Jan 16, 2003
- Katsuhiro Itakura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE
- Publication number 20020158549
- Publication date Oct 31, 2002
- Katsuhiro Itakura
- H03 - BASIC ELECTRONIC CIRCUITRY

Katsuhiro Itakura

Person

Patents Grantslast 30 patents

Wafer holding body

Wafer holding unit

Wafer holder for wafer prober and wafer prober equipped with the same

Wafer holder, and wafer prober provided therewith

Body for keeping a wafer, heater unit and wafer prober

Body for keeping a wafer and wafer prober using the same

Saw device

Method for separating chips from diamond wafer

Surface acoustic wave element

Surface acoustic wave device utilizing a ZnO layer and a diamond layer

Surface acoustic wave device

Patents Applicationslast 30 patents

HEATER

WAFER HOLDING BODY

WAFER HOLDING UNIT

HEATER UNIT, HEATING AND COOLING DEVICE, AND APPARATUS COMPRISING SAME

Wafer holder, heater unit used for wafer prober having the wafer ho...

Wafer holder for wafer prober and wafer prober equipped with same

Wafer holder, heater unit used for wafer prober and having wafer ho...

Wafer holder, and wafer prober provided therewith

Wafer holder, and heater unit and wafer prober provided therewith

Wafer holder, and wafer prober and semiconductor manufacturing appa...

Wafer holder, and heating unit and wafer prober provided with the w...

Wafer holder, heater unit having the wafer holder, and wafer prober...

Heating unit and wafer prober having the same

Wafer holder, heater unit used for wafer prober having the wafer ho...

Wafer holder and wafer prober having the same

Wafer holder, heater unit having the wafer holder, and wafer prober...

Body for keeping a wafer, heater unit and wafer prober

Wafer holder for wafer prober and wafer prober equipped with same

Body for keeping a wafer, method of manufacturing the same and devi...

Body for keeping a wafer and wafer prober using the same

Chuck top, wafer holder having the chuck top, and wafer prober havi...

Wafer holder, heater unit used for wafer prober and having wafer ho...

Wafer holder for wafer prober and wafer prober equipped with the same

Solder film manufacturing method, heat sink furnished with solder f...

Solder film manufacturing method, heat sink furnished with solder f...

Method for separating chips from diamond wafer

Surface acoustic wave element

SURFACE ACOUSTIC WAVE DEVICE