Katsuhito Fukuda

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper foil for printed circuits and method of producing same
- Patent number 5,356,528
- Issue date Oct 18, 1994
- Fukuda Metal Foil & Powder Co., Ltd.
- Katsuhito Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for printed circuits and method of producing same
- Patent number 5,338,619
- Issue date Aug 16, 1994
- Fukuda Metal Foil & Powder Co., Ltd.
- Katsuhito Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of surface treatment of copper foil or a copper clad laminat...
- Patent number 4,981,560
- Issue date Jan 1, 1991
- Fukuda Metal Foil & Powder Industrial Co., Ltd.
- Toshiyuki Kajihara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of treating the surface of the copper foil used in printed w...
- Patent number 4,387,006
- Issue date Jun 7, 1983
- Fukuda Metal Foil & Powder Co., Ltd.
- Toshiyuki Kajiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR