Katsuya Okumura

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Planarization method and system using variable exposure
- Patent number 6,440,644
- Issue date Aug 27, 2002
- Kabushiki Kaisha Toshiba
- Takashi Sato
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Planarized final passivation for semiconductor devices
- Patent number 6,376,911
- Issue date Apr 23, 2002
- International Business Machines Corporation
- James Gardner Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing aluminum interconnect properties
- Patent number 6,200,894
- Issue date Mar 13, 2001
- International Business Machines Corporation
- Thomas J. Licata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization method and system using variable exposure
- Patent number 6,064,466
- Issue date May 16, 2000
- Kabushiki Kaisha Toshiba
- Takashi Sato
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Fabrication process using a multi-layer antireflective layer
- Patent number 5,998,100
- Issue date Dec 7, 1999
- Kabushiki Kaisha Toshiba
- Tsukasa Azuma
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of forming an interconnect
- Patent number 5,950,099
- Issue date Sep 7, 1999
- Kabushiki Kaisha Toshiba
- Naohiro Shoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench filling method using silicon film deposition and silico...
- Patent number 5,888,876
- Issue date Mar 30, 1999
- Kabushiki Kaisha Toshiba
- Jun-ichi Shiozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process using a thin resist
- Patent number 5,759,746
- Issue date Jun 2, 1998
- Kabushiki Kaisha Toshiba
- Tsukasa Azuma
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device having antireflective layer containing organic...
- Patent number 5,744,293
- Issue date Apr 28, 1998
- Kabushiki Kaisha Toshiba
- Katsuya Okumura
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process monitoring and thickness measurement from the back side of...
- Patent number 5,724,144
- Issue date Mar 3, 1998
- International Business Machines Corp.
- Karl Paul Ludwig Muller
- G01 - MEASURING TESTING
Information Patent Grant
Method of planarizing a semiconductor workpiece surface
- Patent number 5,679,610
- Issue date Oct 21, 1997
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Revolving drum polishing apparatus
- Patent number 5,643,056
- Issue date Jul 1, 1997
- Ebara Corporation
- Masayoshi Hirose
- B24 - GRINDING POLISHING
Information Patent Grant
Plasma apparatus
- Patent number 5,639,308
- Issue date Jun 17, 1997
- Kabushiki Kaisha Toshiba
- Yuichiro Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Focused ion beam deposition using TMCTS
- Patent number 5,639,699
- Issue date Jun 17, 1997
- Kabushiki Kaisha Toshiba
- Hiroko Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of cleaning reaction tube and exhaustion piping system in he...
- Patent number 5,637,153
- Issue date Jun 10, 1997
- Tokyo Electron Limited
- Reiji Niino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ temperature measurement using X-ray diffraction
- Patent number 5,636,258
- Issue date Jun 3, 1997
- Siemens Aktiengesellschaft
- Katsuya Okumura
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming a wiring layer for a semiconductor device
- Patent number 5,633,207
- Issue date May 27, 1997
- Kabushiki Kaisha Toshiba
- Hiroyuki Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing tips for atomic force microscopes
- Patent number 5,611,942
- Issue date Mar 18, 1997
- Kabushiki Kaisha Toshiba
- Tadashi Mitsui
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and apparatus for dicing semiconductor wafers
- Patent number 5,609,148
- Issue date Mar 11, 1997
- Siemens Aktiengesellschaft
- Alexander Mitwalsky
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor wafer support apparatus and method
- Patent number 5,605,574
- Issue date Feb 25, 1997
- Kabushiki Kaisha Toshiba
- Yoshitaka Tsunashima
- C30 - CRYSTAL GROWTH
Information Patent Grant
Apparatus for processing semiconductor wafers
- Patent number 5,593,537
- Issue date Jan 14, 1997
- Kabushiki Kaisha Toshiba
- William J. Cote
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for repairing defect on plane surface of phase...
- Patent number 5,569,392
- Issue date Oct 29, 1996
- Kabushiki Kaisha Toshiba
- Motosuke Miyoshi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Magnetic field immersion type electron gun
- Patent number 5,548,183
- Issue date Aug 20, 1996
- Kabushiki Kaisha Toshiba
- Motosuke Miyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of screening semiconductor device
- Patent number 5,543,334
- Issue date Aug 6, 1996
- Kabushiki Kaisha Toshiba
- Ichiro Yoshii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase shift mask and method of fabricating the same
- Patent number 5,536,603
- Issue date Jul 16, 1996
- Kabushiki Kaisha Toshiba
- Takashi Tsuchiya
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Apparatus for processing semiconductor wafers
- Patent number 5,534,106
- Issue date Jul 9, 1996
- Kabushiki Kaisha Toshiba
- William J. Cote
- B24 - GRINDING POLISHING
Information Patent Grant
Defect detecting apparatus and method
- Patent number 5,498,874
- Issue date Mar 12, 1996
- Kabushiki Kaisha Toshiba
- Motosuke Miyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charged particle detection device and charged particle radiation ap...
- Patent number 5,491,339
- Issue date Feb 13, 1996
- Kabushiki Kaisha Toshiba
- Tadashi Mitsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for evaluating characteristics of semiconductor device an...
- Patent number 5,491,425
- Issue date Feb 13, 1996
- Kabushiki Kaisha Toshiba
- Toru Watanabe
- G01 - MEASURING TESTING
Information Patent Grant
Pad condition and polishing rate monitor using fluorescence
- Patent number 5,483,568
- Issue date Jan 9, 1996
- Kabushiki Kaisha Toshiba
- Hiroyuki Yano
- B24 - GRINDING POLISHING

Katsuya Okumura

Person

Patents Grantslast 30 patents

Planarization method and system using variable exposure

Planarized final passivation for semiconductor devices

Method for enhancing aluminum interconnect properties

Planarization method and system using variable exposure

Fabrication process using a multi-layer antireflective layer

Method of forming an interconnect

Deep trench filling method using silicon film deposition and silico...

Fabrication process using a thin resist

Semiconductor device having antireflective layer containing organic...

Process monitoring and thickness measurement from the back side of...

Method of planarizing a semiconductor workpiece surface

Revolving drum polishing apparatus

Plasma apparatus

Focused ion beam deposition using TMCTS

Method of cleaning reaction tube and exhaustion piping system in he...

In-situ temperature measurement using X-ray diffraction

Method of forming a wiring layer for a semiconductor device

Method for producing tips for atomic force microscopes

Method and apparatus for dicing semiconductor wafers

Semiconductor wafer support apparatus and method

Apparatus for processing semiconductor wafers

Method and apparatus for repairing defect on plane surface of phase...

Magnetic field immersion type electron gun

Method of screening semiconductor device

Phase shift mask and method of fabricating the same

Apparatus for processing semiconductor wafers

Defect detecting apparatus and method

Charged particle detection device and charged particle radiation ap...

Apparatus for evaluating characteristics of semiconductor device an...

Pad condition and polishing rate monitor using fluorescence