Katsuyuki Sakuma

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sintering a nanoparticle paste for semiconductor chip join
- Patent number 12,199,059
- Issue date Jan 14, 2025
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Upgrading operating software (“OS”) for devices in a multi-device e...
- Patent number 12,153,912
- Issue date Nov 26, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Piezoelectric device powering smart contact lens with eyelid movement
- Patent number 12,147,091
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Cognitive rotatable item storage with automated replenishment
- Patent number 12,043,482
- Issue date Jul 23, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- G07 - CHECKING-DEVICES
Information Patent Grant
High density interconnection and wiring layers, package structures,...
- Patent number 12,015,003
- Issue date Jun 18, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die assembly
- Patent number 11,973,058
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable multiplatform sensor
- Patent number 11,903,734
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Rajeev Narayanan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic package structure with offset stacked chips and top and...
- Patent number 11,887,908
- Issue date Jan 30, 2024
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature hierarchy solder bonding
- Patent number 11,887,956
- Issue date Jan 30, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular sensing unit
- Patent number 11,850,068
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Rajeev Narayanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of a chip to a substrate
- Patent number 11,824,037
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor circuit power delivery
- Patent number 11,817,394
- Issue date Nov 14, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric die bonding
- Patent number 11,784,160
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder transfer integrated circuit packaging
- Patent number 11,631,650
- Issue date Apr 18, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mitigating cooldown peeling stress during chip package assembly
- Patent number 11,545,444
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate with mixed pitch wiring
- Patent number 11,527,462
- Issue date Dec 13, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-layer adhesion of electronics to a surface
- Patent number 11,471,105
- Issue date Oct 18, 2022
- International Business Machines Corporation
- Leanna Pancoast
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Structure and method for bridge chip assembly with capillary underfill
- Patent number 11,404,379
- Issue date Aug 2, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maintaining smart contact lens power levels
- Patent number 11,392,188
- Issue date Jul 19, 2022
- International Business Machines Corporation
- Sarbajit K. Rakshit
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Forming ultra-thin chips for flexible electronics applications
- Patent number 11,295,982
- Issue date Apr 5, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain gauge structure for a sensor
- Patent number 11,268,867
- Issue date Mar 8, 2022
- International Business Machines Corporation
- John U. Knickerbocker
- G01 - MEASURING TESTING
Information Patent Grant
Heart rate and blood pressure monitoring biosensors
- Patent number 11,246,496
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Paolo Di Achille
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Intraoral device control system
- Patent number 11,197,773
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Katsuyuki Sakuma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Forming wearable stacked strain gauge sensor for monitoring
- Patent number 11,172,837
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Katsuyuki Sakuma
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Active control of electronic package warpage
- Patent number 11,121,096
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantifying grip strength and characterizing movement idioms
- Patent number 11,116,446
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Stephen J. Heisig
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electronics miniaturization platform for medication verification an...
- Patent number 11,094,407
- Issue date Aug 17, 2021
- International Business Machines Corporation
- John Knickerbocker
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Eye-mounted hearing aid
- Patent number 11,076,246
- Issue date Jul 27, 2021
- International Business Machines Corporation
- Amos Cahan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flexible electronics for wearable healthcare sensors
- Patent number 11,015,913
- Issue date May 25, 2021
- International Business Machines Corporation
- Huan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 10,903,187
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPUTER-GENERATED INTERACTIVE HYBRID VIRTUAL ENVIRONMENT FOR ITEM...
- Publication number 20250086914
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Katsuyuki Sakuma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Dicing Street Design for Hybrid Bonding
- Publication number 20250087629
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS
- Publication number 20250006681
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY
- Publication number 20240332239
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD AWARE STACKING AND PACKAGING OF ITEMS
- Publication number 20240320605
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER VOLUME FOR FLIP-CHIP BONDING
- Publication number 20240282735
- Publication date Aug 22, 2024
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures and Processes for Void-Free Hybrid Bonding
- Publication number 20240222313
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING
- Publication number 20240203822
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Evan Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN
- Publication number 20240170288
- Publication date May 23, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
- Publication number 20240113055
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COCHLEAR IMPLANT SYSTEM AND METHOD
- Publication number 20240114302
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Sarbajit K. RAKSHIT
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ASSEMBLY OF A CHIP TO A SUBSTRATE
- Publication number 20240063171
- Publication date Feb 22, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR SENSING UNIT
- Publication number 20240050039
- Publication date Feb 15, 2024
- International Business Machines Corporation
- RAJEEV NARAYANAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING
- Publication number 20230230947
- Publication date Jul 20, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP HIGH MEMORY BANDWIDTH CONFIGURATION
- Publication number 20230197595
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package Structure With Offset Stacked Chips And Top And...
- Publication number 20230197552
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE HIERARCHY SOLDER BONDING
- Publication number 20230197657
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC VIRTUAL REALITY SHOPPING SHELF INTERFACE
- Publication number 20230186375
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REMOTE BASED ONLINE PRODUCT SELECTION
- Publication number 20230186374
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UPGRADING OPERATING SOFTWARE ("OS") FOR DEVICES IN A MULTI-DEVICE E...
- Publication number 20230168877
- Publication date Jun 1, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIPLE DIE ASSEMBLY
- Publication number 20230163100
- Publication date May 25, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT POWER DELIVERY
- Publication number 20230113296
- Publication date Apr 13, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...
- Publication number 20230100769
- Publication date Mar 30, 2023
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-LAYER ADHESION OF ELECTRONICS TO A SURFACE
- Publication number 20220409136
- Publication date Dec 29, 2022
- International Business Machines Corporation
- Leanna Pancoast
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING
- Publication number 20220399298
- Publication date Dec 15, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Body Area Networks
- Publication number 20220344043
- Publication date Oct 27, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SINTERING A NANOPARTICLE PASTE FOR SEMICONDUCTOR CHIP JOIN
- Publication number 20220262754
- Publication date Aug 18, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAINTAINING SMART CONTACT LENS POWER LEVELS
- Publication number 20220214734
- Publication date Jul 7, 2022
- International Business Machines Corporation
- Sarbajit K. Rakshit
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MITIGATING COOLDOWN PEELING STRESS DURING CHIP PACKAGE ASSEMBLY
- Publication number 20220208693
- Publication date Jun 30, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF A CHIP TO A SUBSTRATE
- Publication number 20220208719
- Publication date Jun 30, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Katsuyuki Sakuma

Person

Patents Grantslast 30 patents

Sintering a nanoparticle paste for semiconductor chip join

Upgrading operating software (“OS”) for devices in a multi-device e...

Piezoelectric device powering smart contact lens with eyelid movement

Cognitive rotatable item storage with automated replenishment

High density interconnection and wiring layers, package structures,...

Multiple die assembly

Wearable multiplatform sensor

Electronic package structure with offset stacked chips and top and...

Temperature hierarchy solder bonding

Modular sensing unit

Assembly of a chip to a substrate

Semiconductor circuit power delivery

Asymmetric die bonding

Solder transfer integrated circuit packaging

Mitigating cooldown peeling stress during chip package assembly

Circuit substrate with mixed pitch wiring

Two-layer adhesion of electronics to a surface

Structure and method for bridge chip assembly with capillary underfill

Maintaining smart contact lens power levels

Forming ultra-thin chips for flexible electronics applications

Strain gauge structure for a sensor

Heart rate and blood pressure monitoring biosensors

Intraoral device control system

Forming wearable stacked strain gauge sensor for monitoring

Active control of electronic package warpage

Quantifying grip strength and characterizing movement idioms

Electronics miniaturization platform for medication verification an...

Eye-mounted hearing aid

Flexible electronics for wearable healthcare sensors

Selective area heating for 3D chip stack

Patents Applicationslast 30 patents

COMPUTER-GENERATED INTERACTIVE HYBRID VIRTUAL ENVIRONMENT FOR ITEM...

Dicing Street Design for Hybrid Bonding

UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS

HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY

LOAD AWARE STACKING AND PACKAGING OF ITEMS

SOLDER VOLUME FOR FLIP-CHIP BONDING

Structures and Processes for Void-Free Hybrid Bonding

THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING

INFRARED DEBOND DAMAGE MITIGATION BY COPPER FILL PATTERN

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

COCHLEAR IMPLANT SYSTEM AND METHOD

ASSEMBLY OF A CHIP TO A SUBSTRATE

MODULAR SENSING UNIT

SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING

MULTI-CHIP HIGH MEMORY BANDWIDTH CONFIGURATION

Electronic Package Structure With Offset Stacked Chips And Top And...

TEMPERATURE HIERARCHY SOLDER BONDING

DYNAMIC VIRTUAL REALITY SHOPPING SHELF INTERFACE

REMOTE BASED ONLINE PRODUCT SELECTION

UPGRADING OPERATING SOFTWARE ("OS") FOR DEVICES IN A MULTI-DEVICE E...

MULTIPLE DIE ASSEMBLY

SEMICONDUCTOR CIRCUIT POWER DELIVERY

HIGH DENSITY INTERCONNECTION AND WIRING LAYERS, PACKAGE STRUCTURES,...

TWO-LAYER ADHESION OF ELECTRONICS TO A SURFACE

SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING

Body Area Networks

SINTERING A NANOPARTICLE PASTE FOR SEMICONDUCTOR CHIP JOIN

MAINTAINING SMART CONTACT LENS POWER LEVELS

MITIGATING COOLDOWN PEELING STRESS DURING CHIP PACKAGE ASSEMBLY

ASSEMBLY OF A CHIP TO A SUBSTRATE