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Katsuyuki Toyofuku
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Tokyo, JP
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last 30 patents
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Patent Grant
Palladium bonding wire for semiconductor device
Patent number
5,538,685
Issue date
Jul 23, 1996
Tanaka Denshi Kogyo Kabushiki Kaisha
Katsuyuki Toyofuku
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Clad bonding wire for semiconductor device
Patent number
5,364,706
Issue date
Nov 15, 1994
Tanaka Denshi Kogyo Kabushiki Kaisha
Katsuyuki Toyofuku
B32 - LAYERED PRODUCTS
Information
Patent Grant
High purity gold bonding wire for semiconductor device
Patent number
5,298,219
Issue date
Mar 29, 1994
Tanaka Denshi Kogyo Kabushiki Kaisha
Katsuyuki Toyofuku
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...