Claims
- 1. A bonding wire for a semiconductor device, said bonding wire consisting essentially of:
- high purity Pd or Pd alloy as a base metal; and
- 25-10000 atppm of low boiling point element III, said low boiling point element III having a boiling point lower than a melting point of said base metal and being soluble in Pd, so that a neck portion produced with the bonding wire has a strength at least equal to a strength of the bonding wire.
- 2. The bonding wire according to claim 1, wherein said Pd alloy contains high purity Pd and at least one element selected from the group consisting of Au, Ag, Pt, Rh, Ru, Os, Ir, Cu, Mo, Fe and Ti, thereby providing a Pd alloy having high mechanical strength to enable high-speed bonding and prevention of enlargement of crystal grain in the neck portion upon formation of a ball.
- 3. The bonding wire according to claim 1, wherein said low boiling point element III includes at least one element selected from the group consisting of Zn, Cd, Hg, Li, Mg, Te and Yb.
- 4. The bonding wire according to claim 2, wherein said low boiling point element III includes at least one element selected from the group consisting of Zn, Cd, Hg, Li, Mg, Te and Yb.
- 5. A bonding wire for a semiconductor device, said bonding wire consisting essentially of:
- high purity Pd or Pd alloy as a base metal; and
- 5-500 atppm of low boiling point element IV, wherein said element IV includes at least one element selected from the group consisting of P, S, As and Tl, and said element IV having a boiling point lower than a melting point of said base metal and being insoluble in Pd, so that a neck portion produced with the bonding wire has a strength at least equal to a strength of the bonding wire.
- 6. The bonding wire according to claim 5, wherein said Pd alloy contains high purity Pd and at least one element selected from the group consisting of Au, Ag, Pt, Rh, Ru, Os, Ir, Cu, Mo, Fe and Ti, so that a neck portion produced with the bonding wire has a strength at least equal to a strength of the bonding wire.
- 7. A bonding wire for a semiconductor device, said bonding wire consisting essentially of:
- high purity Pd or Pd alloy containing less than or equal to 10 at % of Au as a base metal;
- 5-10000 atppm of low boiling point element III and low boiling point element IV, said low boiling point element III having a boiling point lower than a melting point of said base metal and being soluble in Pd, said low boiling point element IV having a boiling point lower than a melting point of said base metal and being insoluble in Pd, and said low boiling point element III and said low boiling point element IV being present in a concentration so that (content of said low boiling point element III)/25 + (content of said low boiling element IV)/5.gtoreq.1.gtoreq. (content of said low boiling element III)/10000 + (content of said low boiling element IV)/500, so that a neck portion produced with the bonding wire has a strength at least equal to a strength of the bonding wire.
- 8. The bonding wire according to claim 7, wherein said Pd alloy contains high purity Pd and at least one element selected from the group consisting of Au, Ag, Pt, Rh, Ru, Os, Ir, Cu, Mo, Fe and Ti, so that a neck portion produced with the bonding wire has a strength at least equal to a strength of the bonding wire.
- 9. The bonding wire according to claim 7, wherein said low boiling point element III includes at least one element selected from the group consisting of Zn, Cd, Hg, Li, Mg, Te and Yb.
- 10. The bonding wire according to claim 8, wherein said low boiling point element III includes at least one element selected from the group consisting of Zn, Cd, Hg, Li, Mg, Te and Yb.
- 11. The bonding wire according to claim 7, wherein said low boiling point element IV includes at least one element selected from the group consisting of P, S, As and Tl.
- 12. The bonding wire according to claim 8, wherein said low boiling point element IV includes at least one element selected from the group consisting of P, S, As and Tl.
- 13. The bonding wire according to claim 9, wherein said low boiling point element IV includes at least one element selected from the group consisting of P, S, As and Tl.
Priority Claims (2)
Number |
Date |
Country |
Kind |
2-146498 |
Jun 1990 |
JPX |
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2-146499 |
Jun 1990 |
JPX |
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Parent Case Info
This application is a continuation of application No. 08/171,698, filed Dec. 22, 1993, now abandoned, which is a divisional of application Ser. No. 07/708,204, filed May 31, 1991, now U.S. Pat. No. 5,298,219.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4836984 |
Wagner et al. |
Jun 1989 |
|
4917861 |
Schaffer et al. |
Apr 1990 |
|
5402305 |
Asada et al. |
Mar 1995 |
|
Foreign Referenced Citations (4)
Number |
Date |
Country |
56-049535 |
May 1981 |
JPX |
56-88329 |
Jul 1981 |
JPX |
56-88328 |
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JPX |
64-087735 |
Mar 1989 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
708204 |
May 1991 |
|
Continuations (1)
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Number |
Date |
Country |
Parent |
171698 |
Dec 1993 |
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