Kazuaki SUMITA

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing power module, and power module
- Patent number 11,984,327
- Issue date May 14, 2024
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki Kushihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive resin sheet having light transmission and meth...
- Patent number 11,104,099
- Issue date Aug 31, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshinori Takamatsu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat-curable resin composition, heat-curable resin film and semicon...
- Patent number 10,865,304
- Issue date Dec 15, 2020
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki Kushihara
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Resin composition, resin film, semiconductor laminate, method for m...
- Patent number 10,850,482
- Issue date Dec 1, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoichiro Ichioka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat-curable resin composition
- Patent number 10,829,589
- Issue date Nov 10, 2020
- Shin-Estu Chemical Co., Ltd.
- Naoyuki Kushihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting epoxy resin sheet for encapsulating semiconductor, se...
- Patent number 10,808,102
- Issue date Oct 20, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, resin film, semiconductor laminate, method for m...
- Patent number 10,730,273
- Issue date Aug 4, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoichiro Ichioka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat-curable resin composition for semiconductor encapsulation
- Patent number 10,407,536
- Issue date Sep 10, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-curable resin composition for semiconductor encapsulation
- Patent number 10,385,203
- Issue date Aug 20, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating large-area semiconductor element-mounted b...
- Patent number 9,972,507
- Issue date May 15, 2018
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki Kushihara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Liquid epoxy resin composition for semiconductor sealing and resin-...
- Patent number 9,711,378
- Issue date Jul 18, 2017
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-curable resin composition
- Patent number 9,382,421
- Issue date Jul 5, 2016
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki Kushihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Set of resin compositions for preparing system-in-package type semi...
- Patent number 9,018,281
- Issue date Apr 28, 2015
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam composition for use with multilayer semiconductor package under...
- Patent number 8,828,806
- Issue date Sep 9, 2014
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid epoxy resin composition
- Patent number 7,642,661
- Issue date Jan 5, 2010
- Shin-Etsu Chemical Co., Ltd.
- Masatoshi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid epoxy resin composition and semiconductor device
- Patent number 7,169,833
- Issue date Jan 30, 2007
- Shin-Estu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid epoxy resin composition and semiconductor device
- Patent number 7,094,844
- Issue date Aug 22, 2006
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid epoxy resin composition and semiconductor device
- Patent number 7,067,930
- Issue date Jun 27, 2006
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid epoxy resin composition and semiconductor device
- Patent number 6,780,674
- Issue date Aug 24, 2004
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid epoxy resin composition and semiconductor device
- Patent number 6,733,902
- Issue date May 11, 2004
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid epoxy resin composition and semiconductor device
- Patent number 6,558,812
- Issue date May 6, 2003
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid epoxy resin composition and semiconductor device
- Patent number 6,534,193
- Issue date Mar 18, 2003
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Sealing material for flip-chip semiconductor device, and flip-chip...
- Patent number 6,479,167
- Issue date Nov 12, 2002
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip-chip type semiconductor device sealing material and flip-chip...
- Patent number 6,429,238
- Issue date Aug 6, 2002
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip-chip type semiconductor device underfill material and flip-chi...
- Patent number 6,376,100
- Issue date Apr 23, 2002
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip-chip type semiconductor device sealing material and flip-chip...
- Patent number 6,376,923
- Issue date Apr 23, 2002
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip-chip type semiconductor device underfill
- Patent number 6,372,839
- Issue date Apr 16, 2002
- Shin-Etsu Chemical Co., Ltd.
- Kunio Ito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor sealing liquid epoxy resin compositions
- Patent number 6,323,263
- Issue date Nov 27, 2001
- Shin-Etsu Chemical Co., Ltd.
- Haruyoshi Kuwabawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip-chip type semiconductor device sealing material
- Patent number 6,310,120
- Issue date Oct 30, 2001
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip-chip type semiconductor device sealing material and flip-chip...
- Patent number 6,294,271
- Issue date Sep 25, 2001
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki Sumita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
UNDERFILL COMPOSITION
- Publication number 20240425718
- Publication date Dec 26, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yuri ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION
- Publication number 20240327688
- Publication date Oct 3, 2024
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY CONDUCTIVE RESIN COMPOSITION
- Publication number 20230250328
- Publication date Aug 10, 2023
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE EPOXY RESIN COMPOSITION AND HEAT-CURABLE EPOXY RESIN S...
- Publication number 20230159743
- Publication date May 25, 2023
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING POWER MODULE, AND POWER MODULE
- Publication number 20220068667
- Publication date Mar 3, 2022
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC HEAT-CONDUCTIVE COMPOSITE SILICONE RUBBER SHEET AND MET...
- Publication number 20210170733
- Publication date Jun 10, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshinori TAKAMATSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC HEAT-CONDUCTIVE SHEET HAVING SELF-ADHESIVENESS
- Publication number 20200332064
- Publication date Oct 22, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshinori TAKAMATSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION, HEAT-CURABLE RESIN FILM AND SEMICON...
- Publication number 20200079954
- Publication date Mar 12, 2020
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION
- Publication number 20190330414
- Publication date Oct 31, 2019
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING EPOXY RESIN SHEET FOR ENCAPSULATING SEMICONDUCTOR, SE...
- Publication number 20190241696
- Publication date Aug 8, 2019
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC HEAT- CONDUCTIVE COMPOSITE SILICONE RUBBER SHEET AND ME...
- Publication number 20190217585
- Publication date Jul 18, 2019
- Shin-Etsu Chemical Co., Ltd.
- Yoshinori TAKAMATSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMALLY CONDUCTIVE RESIN SHEET HAVING LIGHT TRANSMISSION AND METH...
- Publication number 20190099980
- Publication date Apr 4, 2019
- Shin-Etsu Chemical Co., Ltd.
- Yoshinori TAKAMATSU
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR LAMINATE, METHOD FOR M...
- Publication number 20190070836
- Publication date Mar 7, 2019
- Shin-Etsu Chemical Co., Ltd.
- Yoichiro ICHIOKA
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR LAMINATE, METHOD FOR M...
- Publication number 20190070837
- Publication date Mar 7, 2019
- Shin-Etsu Chemical Co., Ltd.
- Yoichiro ICHIOKA
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING EPOXY RESIN SHEET FOR ENCAPSULATING SEMICONDUCTOR, SE...
- Publication number 20190055377
- Publication date Feb 21, 2019
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20180327542
- Publication date Nov 15, 2018
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
- Publication number 20180247834
- Publication date Aug 30, 2018
- Shin-Etsu Chemical Co., Ltd.
- Koichi TSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
- Publication number 20180186925
- Publication date Jul 5, 2018
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki SUMITA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION
- Publication number 20180112072
- Publication date Apr 26, 2018
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE EPOXY RESIN COMPOSITION
- Publication number 20180066101
- Publication date Mar 8, 2018
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
- Publication number 20180057663
- Publication date Mar 1, 2018
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki SUMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION
- Publication number 20170362428
- Publication date Dec 21, 2017
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR ENCAPSULATING LARGE-AREA SEMICONDUCTOR ELEMENT-MOUNTED B...
- Publication number 20170316956
- Publication date Nov 2, 2017
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION
- Publication number 20170174879
- Publication date Jun 22, 2017
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION
- Publication number 20170058102
- Publication date Mar 2, 2017
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE EPOXY RESIN COMPOSITION
- Publication number 20170037238
- Publication date Feb 9, 2017
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
- Publication number 20170009007
- Publication date Jan 12, 2017
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki SUMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID RESIN COMPOSITION
- Publication number 20160340470
- Publication date Nov 24, 2016
- Shin-Etsu Chemical Co., Ltd.
- Naoyuki KUSHIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND RESIN-...
- Publication number 20160314992
- Publication date Oct 27, 2016
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki SUMITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIQUID UNDERFILL MATERIAL COMPOSITION FOR SEALING SEMICONDUCTOR AND...
- Publication number 20160186024
- Publication date Jun 30, 2016
- Shin-Etsu Chemical Co., Ltd.
- Kazuaki SUMITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Kazuaki SUMITA

Person

Patents Grantslast 30 patents

Method for producing power module, and power module

Thermally conductive resin sheet having light transmission and meth...

Heat-curable resin composition, heat-curable resin film and semicon...

Resin composition, resin film, semiconductor laminate, method for m...

Heat-curable resin composition

Thermosetting epoxy resin sheet for encapsulating semiconductor, se...

Resin composition, resin film, semiconductor laminate, method for m...

Heat-curable resin composition for semiconductor encapsulation

Heat-curable resin composition for semiconductor encapsulation

Method for encapsulating large-area semiconductor element-mounted b...

Liquid epoxy resin composition for semiconductor sealing and resin-...

Heat-curable resin composition

Set of resin compositions for preparing system-in-package type semi...

Dam composition for use with multilayer semiconductor package under...

Liquid epoxy resin composition

Liquid epoxy resin composition and semiconductor device

Liquid epoxy resin composition and semiconductor device

Liquid epoxy resin composition and semiconductor device

Liquid epoxy resin composition and semiconductor device

Liquid epoxy resin composition and semiconductor device

Liquid epoxy resin composition and semiconductor device

Liquid epoxy resin composition and semiconductor device

Sealing material for flip-chip semiconductor device, and flip-chip...

Flip-chip type semiconductor device sealing material and flip-chip...

Flip-chip type semiconductor device underfill material and flip-chi...

Flip-chip type semiconductor device sealing material and flip-chip...

Flip-chip type semiconductor device underfill

Semiconductor sealing liquid epoxy resin compositions

Flip-chip type semiconductor device sealing material

Flip-chip type semiconductor device sealing material and flip-chip...

Patents Applicationslast 30 patents

UNDERFILL COMPOSITION

EPOXY RESIN COMPOSITION

THERMALLY CONDUCTIVE RESIN COMPOSITION

HEAT-CURABLE EPOXY RESIN COMPOSITION AND HEAT-CURABLE EPOXY RESIN S...

METHOD FOR PRODUCING POWER MODULE, AND POWER MODULE

ANISOTROPIC HEAT-CONDUCTIVE COMPOSITE SILICONE RUBBER SHEET AND MET...

ANISOTROPIC HEAT-CONDUCTIVE SHEET HAVING SELF-ADHESIVENESS

HEAT-CURABLE RESIN COMPOSITION, HEAT-CURABLE RESIN FILM AND SEMICON...

HEAT-CURABLE RESIN COMPOSITION

THERMOSETTING EPOXY RESIN SHEET FOR ENCAPSULATING SEMICONDUCTOR, SE...

ANISOTROPIC HEAT- CONDUCTIVE COMPOSITE SILICONE RUBBER SHEET AND ME...

THERMALLY CONDUCTIVE RESIN SHEET HAVING LIGHT TRANSMISSION AND METH...

RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR LAMINATE, METHOD FOR M...

RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR LAMINATE, METHOD FOR M...

THERMOSETTING EPOXY RESIN SHEET FOR ENCAPSULATING SEMICONDUCTOR, SE...

EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS

HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION

LIQUID EPOXY RESIN COMPOSITION

HEAT-CURABLE EPOXY RESIN COMPOSITION

HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION

EPOXY RESIN COMPOSITION

METHOD FOR ENCAPSULATING LARGE-AREA SEMICONDUCTOR ELEMENT-MOUNTED B...

LIQUID EPOXY RESIN COMPOSITION

HEAT-CURABLE RESIN COMPOSITION

HEAT-CURABLE EPOXY RESIN COMPOSITION

HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION

LIQUID RESIN COMPOSITION

LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND RESIN-...

LIQUID UNDERFILL MATERIAL COMPOSITION FOR SEALING SEMICONDUCTOR AND...