Kazuhiro Kobayashi

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board having two insulating films and hole penetrating there...
- Patent number 11,152,293
- Issue date Oct 19, 2021
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 10,811,348
- Issue date Oct 20, 2020
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component built-in substrate and electronic device
- Patent number 10,211,119
- Issue date Feb 19, 2019
- Shinko Electric Industries Co., Ltd.
- Yasuhiko Kusama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a wiring substrate
- Patent number 10,117,336
- Issue date Oct 30, 2018
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,961,785
- Issue date May 1, 2018
- Shinko Electric Co., Ltd.
- Junji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 9,961,767
- Issue date May 1, 2018
- SHINKO ELECTRIC INDUSTIRES CO., LTD.
- Kazuhiro Oshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 9,852,970
- Issue date Dec 26, 2017
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support body, method of manufacturing support body, method of manuf...
- Patent number 9,763,332
- Issue date Sep 12, 2017
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and electronic component device
- Patent number 9,698,094
- Issue date Jul 4, 2017
- Shinko Electric Industries Co., Ltd.
- Hiroharu Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 9,627,308
- Issue date Apr 18, 2017
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 9,627,309
- Issue date Apr 18, 2017
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,345,143
- Issue date May 17, 2016
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 9,253,897
- Issue date Feb 2, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,247,644
- Issue date Jan 26, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, method for manufacturing the wiring substrate, an...
- Patent number 9,232,642
- Issue date Jan 5, 2016
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support body, method of manufacturing support body, method of manuf...
- Patent number 9,215,812
- Issue date Dec 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,210,808
- Issue date Dec 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 9,137,896
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board
- Patent number 9,089,041
- Issue date Jul 21, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring board having pads highly resistant...
- Patent number 9,024,207
- Issue date May 5, 2015
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 9,006,103
- Issue date Apr 14, 2015
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate including projecting part having electrode pad for...
- Patent number 8,810,040
- Issue date Aug 19, 2014
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 8,797,757
- Issue date Aug 5, 2014
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method thereof
- Patent number 8,760,883
- Issue date Jun 24, 2014
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
Information Patent Grant
Wiring substrate, manufacturing method thereof, and semiconductor p...
- Patent number 8,673,744
- Issue date Mar 18, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing temporary substrate
- Patent number 8,539,668
- Issue date Sep 24, 2013
- Shinko Electric Industries Co., Ltd.
- Takeshi Okada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wiring substrate, manufacturing method thereof, and semiconductor p...
- Patent number 8,525,356
- Issue date Sep 3, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 8,476,536
- Issue date Jul 2, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 8,399,779
- Issue date Mar 19, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board manufacturing method, semiconductor device manufacturi...
- Patent number 8,237,270
- Issue date Aug 7, 2012
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20230319992
- Publication date Oct 5, 2023
- Shinko Electric Industries Co., Ltd.
- Koichi Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20200105651
- Publication date Apr 2, 2020
- Shinko Electric Industries Co., Ltd.
- Kazuhiro OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOTOR DEVICE AND VEHICLE-MOUNTED SEAT AIR CONDITIONER
- Publication number 20200028455
- Publication date Jan 23, 2020
- SHINANO KENSHI CO., LTD.
- Yuki KOSAKA
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20180151486
- Publication date May 31, 2018
- Shinko Electric Industries Co., Ltd.
- Kazuhiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20180047661
- Publication date Feb 15, 2018
- Shinko Electric Industries Co., Ltd.
- Kazuhiro OSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND ELECTRONIC COMPONENT DEVICE
- Publication number 20170040249
- Publication date Feb 9, 2017
- Shinko Electric Industries Co., Ltd.
- Hiroharu Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20160353576
- Publication date Dec 1, 2016
- Shinko Electric Industries Co., Ltd.
- Yasuhiko Kusama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20160322294
- Publication date Nov 3, 2016
- Shinko Electric Industries Co., Ltd.
- Kazuhiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20160322289
- Publication date Nov 3, 2016
- Shinko Electric Industries Co., Ltd.
- Kazuhiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20160322295
- Publication date Nov 3, 2016
- Shinko Electric Industries Co., Ltd.
- Kazuhiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20160234932
- Publication date Aug 11, 2016
- Shinko Electric Industries Co., Ltd.
- Kazuhiro OSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate and Semiconductor Device
- Publication number 20160081194
- Publication date Mar 17, 2016
- Shinko Electric Industries Co., Ltd.
- Junji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT BODY, METHOD OF MANUFACTURING SUPPORT BODY, METHOD OF MANUF...
- Publication number 20160066433
- Publication date Mar 3, 2016
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160044792
- Publication date Feb 11, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20150289380
- Publication date Oct 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150014020
- Publication date Jan 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150014027
- Publication date Jan 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140097009
- Publication date Apr 10, 2014
- Kentaro KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20140087556
- Publication date Mar 27, 2014
- Shinko Electric Industries Co., Ltd.
- Kazuhiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140076614
- Publication date Mar 20, 2014
- Shinko Electric Industries Co., Ltd.
- Kazuhiro KOBAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT BODY, METHOD OF MANUFACTURING SUPPORT BODY, METHOD OF MANUF...
- Publication number 20140020931
- Publication date Jan 23, 2014
- Kazuhiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE WIRING SUBSTRATE, AN...
- Publication number 20140021625
- Publication date Jan 23, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE
- Publication number 20130314886
- Publication date Nov 28, 2013
- Shinko Electric Industries Co., Ltd.
- Kazuhiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR P...
- Publication number 20130269185
- Publication date Oct 17, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130185936
- Publication date Jul 25, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130153271
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, MANUFACTURING METHOD OF WIRING SUBSTRATE, AND SEM...
- Publication number 20130140692
- Publication date Jun 6, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SUPPORT MEMBER FOR MANUFACTURING WIRING SUBSTRATE, AND S...
- Publication number 20130143062
- Publication date Jun 6, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20130134127
- Publication date May 30, 2013
- Shinko Electric Industries Co., Ltd.
- Kotaro KODANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130075145
- Publication date Mar 28, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro KANEKO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Kazuhiro Kobayashi

Person

Patents Grantslast 30 patents

Wiring board having two insulating films and hole penetrating there...

Method of manufacturing wiring substrate

Electronic component built-in substrate and electronic device

Method of manufacturing a wiring substrate

Wiring substrate and semiconductor device

Circuit board and method of manufacturing circuit board

Wiring substrate

Support body, method of manufacturing support body, method of manuf...

Wiring board and electronic component device

Wiring substrate

Wiring substrate

Method of fabricating a wiring board

Wiring substrate and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring substrate, method for manufacturing the wiring substrate, an...

Support body, method of manufacturing support body, method of manuf...

Wiring substrate and method of manufacturing the same

Wiring substrate

Method of fabricating a wiring board

Method of manufacturing a wiring board having pads highly resistant...

Method of manufacturing wiring substrate

Wiring substrate including projecting part having electrode pad for...

Wiring substrate and manufacturing method thereof

Wiring substrate and manufacturing method thereof

Wiring substrate, manufacturing method thereof, and semiconductor p...

Apparatus for manufacturing temporary substrate

Wiring substrate, manufacturing method thereof, and semiconductor p...

Wiring substrate and method for manufacturing the same

Wiring board and method of manufacturing the same

Wiring board manufacturing method, semiconductor device manufacturi...

Patents Applicationslast 30 patents

WIRING SUBSTRATE

WIRING BOARD

MOTOR DEVICE AND VEHICLE-MOUNTED SEAT AIR CONDITIONER

METHOD OF MANUFACTURING WIRING SUBSTRATE

WIRING BOARD

WIRING BOARD AND ELECTRONIC COMPONENT DEVICE

ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND ELECTRONIC DEVICE

WIRING SUBSTRATE

WIRING SUBSTRATE

WIRING SUBSTRATE

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

Wiring Substrate and Semiconductor Device

SUPPORT BODY, METHOD OF MANUFACTURING SUPPORT BODY, METHOD OF MANUF...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND METHOD OF FABRICATING THE SAME

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE

METHOD OF MANUFACTURING WIRING SUBSTRATE

WIRING SUBSTRATE

SUPPORT BODY, METHOD OF MANUFACTURING SUPPORT BODY, METHOD OF MANUF...

WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE WIRING SUBSTRATE, AN...

WIRING BOARD AND MOUNTING STRUCTURE

WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR P...

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE, MANUFACTURING METHOD OF WIRING SUBSTRATE, AND SEM...

METHOD AND SUPPORT MEMBER FOR MANUFACTURING WIRING SUBSTRATE, AND S...

WIRING BOARD AND METHOD OF FABRICATING THE SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME