Kazuhiro Mori

Person

Katano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Production system and production method
- Patent number 6,952,624
- Issue date Oct 4, 2005
- Shigematsu Co., Ltd
- Kazuhiro Mori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing article having electronic circuit
- Patent number 6,708,401
- Issue date Mar 23, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hidenori Miyakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packing band, packing method and packing apparatus, of little parts...
- Patent number 6,250,051
- Issue date Jun 26, 2001
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Mori
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Carrier band of electronic parts
- Patent number 6,142,306
- Issue date Nov 7, 2000
- Nissho Corporation
- Kazuhiro Mori
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Packing band, packing method and packing apparatus, of little parts...
- Patent number 6,101,790
- Issue date Aug 15, 2000
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Mori
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Automatic feeding system having animal carried transmitter which tr...
- Patent number 6,044,795
- Issue date Apr 4, 2000
- Matsushita Electronics Corporation
- Taketoshi Matsuura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Graphite cladding laminate structural material and a graphite devic...
- Patent number 6,027,807
- Issue date Feb 22, 2000
- Matsushita Electric Industrial Co., Ltd.
- Takao Inoue
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of molding high-viscosity materials
- Patent number 5,785,903
- Issue date Jul 28, 1998
- Matsushita Electric Industrial Co., Ltd.
- Takao Inoue
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of packaging electronic chip component and method of bonding...
- Patent number 5,744,382
- Issue date Apr 28, 1998
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Kitayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic chip component with passivation film and organic protect...
- Patent number 5,646,439
- Issue date Jul 8, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Kitayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transporting/storing a wafer in a wafer carrier
- Patent number 5,502,953
- Issue date Apr 2, 1996
- Matsushita Electric Industrial Co., Ltd.
- Ichiro Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling-type clean space apparatus
- Patent number 5,425,793
- Issue date Jun 20, 1995
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Mori
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Method for transporting/storing wafer and wafer carrier
- Patent number 5,360,106
- Issue date Nov 1, 1994
- Matsushita Electric Industrial Co., Ltd.
- Ichiro Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick film drawing apparatus
- Patent number 5,080,036
- Issue date Jan 14, 1992
- Matsushita Electric Industrial Co., Ltd.
- Akira Kabeshita
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for fabricating electronic circuit board
- Patent number 4,825,536
- Issue date May 2, 1989
- Matsushita Electric Industrial Co., Ltd.
- Eiji Itemadani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of loading parts
- Patent number 4,807,356
- Issue date Feb 28, 1989
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Maruyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting electronic parts
- Patent number 4,790,069
- Issue date Dec 13, 1988
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Maruyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Injection apparatus including means for feeding solid resin to an i...
- Patent number 4,600,375
- Issue date Jul 15, 1986
- Matsushita Electric Industrial Co., Ltd.
- Norihisa Honsho
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of circuit connection across both surfaces of substrate
- Patent number 4,592,137
- Issue date Jun 3, 1986
- Matsushita Electric Industrial Co., Ltd.
- Souhei Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting apparatus
- Patent number 4,473,247
- Issue date Sep 25, 1984
- Matsushita Electric Industrial Co., Ltd.
- Eiji Itemadani
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Electronic component supply apparatus
- Patent number 4,440,355
- Issue date Apr 3, 1984
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts mounting apparatus
- Patent number 4,437,232
- Issue date Mar 20, 1984
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Araki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly devices for electronic circuit components
- Patent number 4,411,362
- Issue date Oct 25, 1983
- Matsushita Electric Industrial Co., Ltd.
- Eiji Itemadani
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Electronic component inserting apparatus
- Patent number 4,370,804
- Issue date Feb 1, 1983
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiko Misawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for packaging electrical circuit components
- Patent number 4,354,337
- Issue date Oct 19, 1982
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component inserting apparatus
- Patent number 4,329,776
- Issue date May 18, 1982
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic parts mounting apparatus
- Patent number 4,327,482
- Issue date May 4, 1982
- Matsushita Electric Industrial Co., Ltd.
- Shigeru Araki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component engaging apparatus
- Patent number 4,307,832
- Issue date Dec 29, 1981
- Matsushita Electric Industrial Co., Ltd.
- Yasuo Taki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatic apparatus for inserting electric components
- Patent number 4,293,998
- Issue date Oct 13, 1981
- Matsushita Electric Industrial Co., Ltd.
- Hidetoshi Kawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for carrying and placing components
- Patent number 4,290,732
- Issue date Sep 22, 1981
- Matsushita Electric Industrial Co. Ltd.
- Yasuo Taki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Production system and production method
- Publication number 20040162628
- Publication date Aug 19, 2004
- Shigematsu Co., Ltd.
- Kazuhiro Mori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Article with electronic circuit formed and method of manufacturing...
- Publication number 20040078965
- Publication date Apr 29, 2004
- Hidenori Miyakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Article with electronic circuit formed and method of manufacturing...
- Publication number 20020036898
- Publication date Mar 28, 2002
- Hidenori Miyakawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Kazuhiro Mori

Person

Patents Grantslast 30 patents

Production system and production method

Method of manufacturing article having electronic circuit

Packing band, packing method and packing apparatus, of little parts...

Carrier band of electronic parts

Packing band, packing method and packing apparatus, of little parts...

Automatic feeding system having animal carried transmitter which tr...

Graphite cladding laminate structural material and a graphite devic...

Method of molding high-viscosity materials

Method of packaging electronic chip component and method of bonding...

Electronic chip component with passivation film and organic protect...

Method for transporting/storing a wafer in a wafer carrier

Coupling-type clean space apparatus

Method for transporting/storing wafer and wafer carrier

Thick film drawing apparatus

Method for fabricating electronic circuit board

Method of loading parts

Method and apparatus for mounting electronic parts

Injection apparatus including means for feeding solid resin to an i...

Method of circuit connection across both surfaces of substrate

Component mounting apparatus

Electronic component supply apparatus

Electronic parts mounting apparatus

Assembly devices for electronic circuit components

Electronic component inserting apparatus

Apparatus for packaging electrical circuit components

Component inserting apparatus

Electronic parts mounting apparatus

Component engaging apparatus

Automatic apparatus for inserting electric components

Apparatus for carrying and placing components

Patents Applicationslast 30 patents

Production system and production method

Article with electronic circuit formed and method of manufacturing...

Article with electronic circuit formed and method of manufacturing...