Kazuhiro Tsuruta

Person

Ohbu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 8,598,458
- Issue date Dec 3, 2013
- Denso Corporation
- Hiroshi Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing silicon carbide semiconductor device
- Patent number 8,216,929
- Issue date Jul 10, 2012
- Denso Corporation
- Jun Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate for a one-chip electronic device and relate...
- Patent number 6,790,751
- Issue date Sep 14, 2004
- Denso Corporation
- Kazuhiro Tsuruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,914,515
- Issue date Jun 22, 1999
- Nippondenso Co., Ltd.
- Harutsugu Fukumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an SOI structure of mesa isolation type...
- Patent number 5,663,588
- Issue date Sep 2, 1997
- Nippondenso Co., Ltd.
- Megumi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device having excellent dual polar...
- Patent number 5,610,426
- Issue date Mar 11, 1997
- Nippondenso Co., Ltd.
- Akiyoshi Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having SOI structure and method for fabricatin...
- Patent number 5,567,968
- Issue date Oct 22, 1996
- Nippondenso Co., Ltd.
- Kazuhiro Tsuruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI MOSFET with floating gate
- Patent number 5,488,243
- Issue date Jan 30, 1996
- Nippondenso Co., Ltd.
- Kazuhiro Tsuruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure for producing two isolated circui...
- Patent number 5,461,253
- Issue date Oct 24, 1995
- Nippon Steel Inc.
- Kazuhiro Tsuruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 5,383,993
- Issue date Jan 24, 1995
- Nippon Soken Inc.
- Mitsutaka Katada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device having walls of an inverted mesa shape t...
- Patent number 5,313,092
- Issue date May 17, 1994
- Nippon Soken, Inc.
- Kazuhiro Tsuruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor substrate having dielectric separ...
- Patent number 5,223,450
- Issue date Jun 29, 1993
- Nippon Soken, Inc.
- Seiji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit structure and method for making the same
- Patent number 5,204,282
- Issue date Apr 20, 1993
- Nippon Soken, Inc.
- Kazuhiro Tsuruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for producing the same
- Patent number 5,164,218
- Issue date Nov 17, 1992
- Nippon Soken, Inc.
- Kazuhiro Tsuruta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230326845
- Publication date Oct 12, 2023
- DENSO CORPORATION
- YOSHITAKA KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220392828
- Publication date Dec 8, 2022
- DENSO CORPORATION
- YOSHITAKA KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20110306188
- Publication date Dec 15, 2011
- DENSO CORPORATION
- Jun KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110192630
- Publication date Aug 11, 2011
- DENSO CORPORATION
- Hiroshi Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing silicon carbide semiconductor device
- Publication number 20110092063
- Publication date Apr 21, 2011
- DENSO CORPORATION
- Jun Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate and manufacturing process therefor
- Publication number 20050012175
- Publication date Jan 20, 2005
- Kazuhiro Tsuruta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate for a one-chip electronic device and relate...
- Publication number 20030067014
- Publication date Apr 10, 2003
- Kazuhiro Tsuruta
- H01 - BASIC ELECTRIC ELEMENTS

Kazuhiro Tsuruta

Person

Patents Grantslast 30 patents

Electronic device and method of manufacturing the same

Method of manufacturing silicon carbide semiconductor device

Semiconductor substrate for a one-chip electronic device and relate...

Semiconductor device

Semiconductor device having an SOI structure of mesa isolation type...

Semiconductor integrated circuit device having excellent dual polar...

Semiconductor device having SOI structure and method for fabricatin...

SOI MOSFET with floating gate

Semiconductor substrate structure for producing two isolated circui...

Method of bonding semiconductor substrates

Semiconductor power device having walls of an inverted mesa shape t...

Method of producing semiconductor substrate having dielectric separ...

Semiconductor circuit structure and method for making the same

Semiconductor device and a method for producing the same

Patents Applicationslast 30 patents

CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SILICON CARBIDE SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing silicon carbide semiconductor device

Semiconductor substrate and manufacturing process therefor

Semiconductor substrate for a one-chip electronic device and relate...