Kazuhiro Yoshikawa

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thin film capacitor
- Patent number 11,942,278
- Issue date Mar 26, 2024
- TDK Corporation
- Michihiro Kumagae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor having a dielectric layer having a through hole...
- Patent number 11,676,767
- Issue date Jun 13, 2023
- TDK Corporation
- Yuuki Aburakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and its manufacturing method
- Patent number 11,545,303
- Issue date Jan 3, 2023
- TDK Corporation
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and its manufacturing method
- Patent number 11,452,209
- Issue date Sep 20, 2022
- TDK Corporation
- Yuichiro Okuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film capacitor, circuit board incorporating the same, and thin...
- Patent number 11,430,611
- Issue date Aug 30, 2022
- TDK Corporation
- Yuuki Aburakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-incorporating substrate
- Patent number 11,367,626
- Issue date Jun 21, 2022
- TDK Corporation
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,357,110
- Issue date Jun 7, 2022
- TDK Corporation
- Takeshi Oohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film capacitor and method for manufacturing thin-film capacitor
- Patent number 11,276,531
- Issue date Mar 15, 2022
- TDK Corporation
- Koichi Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and circuit board incorporating the same
- Patent number 11,240,908
- Issue date Feb 1, 2022
- TDK Corporation
- Kazuhiro Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etching manufacturing method of thin film capacitor
- Patent number 11,195,661
- Issue date Dec 7, 2021
- TDK Corporation
- Michihiro Kumagae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and manufacturing method thereof
- Patent number 11,114,248
- Issue date Sep 7, 2021
- TDK Corporation
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film capacitor
- Patent number 11,114,249
- Issue date Sep 7, 2021
- TDK Corporation
- Koichi Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor, manufacturing method therefor, and multilayer...
- Patent number 11,011,315
- Issue date May 18, 2021
- TDK Corporation
- Michihiro Kumagae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film capacitor
- Patent number 10,950,389
- Issue date Mar 16, 2021
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting package
- Patent number 10,886,219
- Issue date Jan 5, 2021
- TDK Corporation
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded substrate
- Patent number 10,813,220
- Issue date Oct 20, 2020
- TDK Corporation
- Mitsuhiro Tomikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film capacitor and multilayer circuit board having the thin fi...
- Patent number 10,699,844
- Issue date Jun 30, 2020
- TDK Corporation
- Hitoshi Saita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded substrate
- Patent number 10,483,345
- Issue date Nov 19, 2019
- TDK Corporation
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film capacitor
- Patent number 10,340,088
- Issue date Jul 2, 2019
- TDK Corporation
- Koichi Tsunoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin-film capacitor
- Patent number 10,319,524
- Issue date Jun 11, 2019
- TDK Corporation
- Kenichi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film capacitor
- Patent number 10,153,092
- Issue date Dec 11, 2018
- TDK Corporation
- Michihiro Kumagae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,693,458
- Issue date Jun 27, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,578,745
- Issue date Feb 21, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,572,256
- Issue date Feb 14, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor device, method for manufacturing the same and printed wiri...
- Patent number 9,514,876
- Issue date Dec 6, 2016
- Ibiden Co., Ltd.
- Yasuhiko Mano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor device, method for manufacturing the same and printed wiri...
- Patent number 9,508,483
- Issue date Nov 29, 2016
- Ibiden Co., Ltd.
- Yasuhiko Mano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,478,343
- Issue date Oct 25, 2016
- Ibiden Co., Ltd.
- Haruhiko Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, and method for manufacturing printed circuit...
- Patent number 9,357,660
- Issue date May 31, 2016
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,307,645
- Issue date Apr 5, 2016
- Ibiden Co., Ltd.
- Yasuhiko Mano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, inductor component, and method for manufactur...
- Patent number 9,287,034
- Issue date Mar 15, 2016
- Ibiden Co., Ltd.
- Yasuhiko Mano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND APPARATUS
- Publication number 20240203972
- Publication date Jun 20, 2024
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20240087787
- Publication date Mar 14, 2024
- TDK Corporation
- Yuki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
- Publication number 20230138154
- Publication date May 4, 2023
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230060995
- Publication date Mar 2, 2023
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
- Publication number 20230005667
- Publication date Jan 5, 2023
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR
- Publication number 20220044875
- Publication date Feb 10, 2022
- TDK Corporation
- Michihiro KUMAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR, CIRCUIT BOARD INCORPORATING THE SAME, AND THIN...
- Publication number 20210272757
- Publication date Sep 2, 2021
- TDK Corporation
- Yuuki ABURAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR, CIRCUIT BOARD INCORPORATING THE SAME, AND THIN...
- Publication number 20210265116
- Publication date Aug 26, 2021
- TDK Corporation
- Yuuki ABURAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
- Publication number 20210225593
- Publication date Jul 22, 2021
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
- Publication number 20210219430
- Publication date Jul 15, 2021
- TDK Corporation
- Yuichiro OKUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20210204406
- Publication date Jul 1, 2021
- TDK Corporation
- Takeshi OOHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CAPACITOR AND METHOD FOR MANUFACTURING THIN-FILM CAPACITOR
- Publication number 20200258690
- Publication date Aug 13, 2020
- TDK CORPORATION
- Koichi TSUNODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR AND CIRCUIT BOARD INCORPORATING THE SAME
- Publication number 20200137883
- Publication date Apr 30, 2020
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
- Publication number 20200043751
- Publication date Feb 6, 2020
- TDK Corporation
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20200013554
- Publication date Jan 9, 2020
- TDK CORPORATION
- Koichi TSUNODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND MULTILAYER...
- Publication number 20190392992
- Publication date Dec 26, 2019
- TDK Corporation
- Michihiro KUMAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING PACKAGE
- Publication number 20190378791
- Publication date Dec 12, 2019
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20190304701
- Publication date Oct 3, 2019
- TDK Corporation
- Daiki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR AND MANUFACTURING METHOD THEREOF
- Publication number 20190287726
- Publication date Sep 19, 2019
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF THIN FILM CAPACITOR AND THIN FILM CAPACITOR
- Publication number 20190279823
- Publication date Sep 12, 2019
- TDK Corporation
- Michihiro KUMAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20180240599
- Publication date Aug 23, 2018
- TDK Corporation
- Koichi TSUNODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20180233553
- Publication date Aug 16, 2018
- TDK Corporation
- Mitsuhiro TOMIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20180235086
- Publication date Aug 16, 2018
- TDK Corporation
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20180102218
- Publication date Apr 12, 2018
- TDK Corporation
- Kenichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CAPACITOR
- Publication number 20180102219
- Publication date Apr 12, 2018
- TDK Corporation
- Michihiro KUMAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR COMPONENT AND PRINTED WIRING BOARD
- Publication number 20160217911
- Publication date Jul 28, 2016
- IBIDEN CO., LTD.
- Yasuhiko MANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160042861
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Yasuhiko MANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...
- Publication number 20150250054
- Publication date Sep 3, 2015
- IBIDEN CO., LTD.
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND PRINTED WIRI...
- Publication number 20150137931
- Publication date May 21, 2015
- IBIDEN CO., LTD.
- Yasuhiko Mano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...
- Publication number 20150098204
- Publication date Apr 9, 2015
- IBIDEN CO., LTD.
- Kazuhiro YOSHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kazuhiro Yoshikawa

Person

Patents Grantslast 30 patents

Thin film capacitor

Thin film capacitor having a dielectric layer having a through hole...

Electronic component and its manufacturing method

Electronic component and its manufacturing method

Thin film capacitor, circuit board incorporating the same, and thin...

Electronic component-incorporating substrate

Electronic component

Thin-film capacitor and method for manufacturing thin-film capacitor

Thin film capacitor and circuit board incorporating the same

Etching manufacturing method of thin film capacitor

Thin film capacitor and manufacturing method thereof

Thin-film capacitor

Thin film capacitor, manufacturing method therefor, and multilayer...

Thin-film capacitor

Electronic component mounting package

Electronic component embedded substrate

Thin film capacitor and multilayer circuit board having the thin fi...

Electronic component embedded substrate

Thin-film capacitor

Thin-film capacitor

Thin-film capacitor

Printed wiring board, method for manufacturing printed wiring board...

Printed wiring board, method for manufacturing printed wiring board...

Printed wiring board, method for manufacturing printed wiring board...

Inductor device, method for manufacturing the same and printed wiri...

Inductor device, method for manufacturing the same and printed wiri...

Printed wiring board

Printed circuit board, and method for manufacturing printed circuit...

Printed wiring board and method for manufacturing printed wiring board

Printed wiring board, inductor component, and method for manufactur...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND APPARATUS

COIL COMPONENT

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD

THIN FILM CAPACITOR

THIN FILM CAPACITOR, CIRCUIT BOARD INCORPORATING THE SAME, AND THIN...

THIN FILM CAPACITOR, CIRCUIT BOARD INCORPORATING THE SAME, AND THIN...

ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD

ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD

ELECTRONIC COMPONENT

THIN-FILM CAPACITOR AND METHOD FOR MANUFACTURING THIN-FILM CAPACITOR

THIN FILM CAPACITOR AND CIRCUIT BOARD INCORPORATING THE SAME

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

THIN-FILM CAPACITOR

THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND MULTILAYER...

ELECTRONIC COMPONENT MOUNTING PACKAGE

THIN-FILM CAPACITOR

THIN FILM CAPACITOR AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF THIN FILM CAPACITOR AND THIN FILM CAPACITOR

THIN-FILM CAPACITOR

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

THIN-FILM CAPACITOR

THIN-FILM CAPACITOR

INDUCTOR COMPONENT AND PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...

INDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND PRINTED WIRI...

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...