Kazuhisa Arai

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin sheet attaching method
- Patent number 9,627,241
- Issue date Apr 18, 2017
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for photomask
- Patent number 9,400,423
- Issue date Jul 26, 2016
- Disco Corporation
- Kazuhisa Arai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wafer dividing method
- Patent number 8,673,743
- Issue date Mar 18, 2014
- Disco Corporation
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding machine and method
- Patent number 8,142,259
- Issue date Mar 27, 2012
- Disco Corporation
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer processing method
- Patent number 7,816,264
- Issue date Oct 19, 2010
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dividing method
- Patent number 7,727,810
- Issue date Jun 1, 2010
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device manufacturing method
- Patent number 7,704,769
- Issue date Apr 27, 2010
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lamination device manufacturing method
- Patent number 7,687,375
- Issue date Mar 30, 2010
- Disco Corporation
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 7,498,239
- Issue date Mar 3, 2009
- Disco Corporation
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Grant
Method of preparing terminal board
- Patent number 7,278,206
- Issue date Oct 9, 2007
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonder
- Patent number 7,222,772
- Issue date May 29, 2007
- Disco Corporation
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor wafer
- Patent number 7,183,178
- Issue date Feb 27, 2007
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer support plate
- Patent number 6,927,416
- Issue date Aug 9, 2005
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip pick-up method
- Patent number 6,759,274
- Issue date Jul 6, 2004
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of grinding rear side of semiconductor wafer
- Patent number 6,702,652
- Issue date Mar 9, 2004
- Disco Corporation
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer dividing method
- Patent number 6,676,491
- Issue date Jan 13, 2004
- Disco Corporation
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Grant
Method of separating a plate-like workpiece held by adhesion on an...
- Patent number 6,594,890
- Issue date Jul 22, 2003
- Disco Corporation
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer grinding method
- Patent number 6,527,627
- Issue date Mar 4, 2003
- Disco Corporation
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer having regular or irregular chip pattern and di...
- Patent number 6,528,864
- Issue date Mar 4, 2003
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer cutting machine
- Patent number 6,500,047
- Issue date Dec 31, 2002
- Disco Corporation
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for grinding spherical objects
- Patent number 6,358,132
- Issue date Mar 19, 2002
- Disco Corporation
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20150093882
- Publication date Apr 2, 2015
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR PHOTOMASK
- Publication number 20150093688
- Publication date Apr 2, 2015
- Disco Corporation
- Kazuhisa Arai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
RESIN SHEET ATTACHING METHOD
- Publication number 20150013897
- Publication date Jan 15, 2015
- Disco Corporation
- Kazuhisa Arai
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER DIVIDING METHOD
- Publication number 20130059428
- Publication date Mar 7, 2013
- Disco Corporation
- Kazuhisa ARAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATION METHOD
- Publication number 20100003805
- Publication date Jan 7, 2010
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CUTTING ADHESIVE FILM ON A SINGULATED WAFER BACKSIDE
- Publication number 20090298264
- Publication date Dec 3, 2009
- DISCO CORPORATION
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRINDING MACHINE AND METHOD
- Publication number 20090280722
- Publication date Nov 12, 2009
- Disco Corporation
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Application
OPTICAL DEVICE MANUFACTURING METHOD
- Publication number 20090233419
- Publication date Sep 17, 2009
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION DEVICE MANUFACTURING METHOD
- Publication number 20090181519
- Publication date Jul 16, 2009
- Disco Corporation
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20090017623
- Publication date Jan 15, 2009
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device and manufacturing method therefor
- Publication number 20070057378
- Publication date Mar 15, 2007
- DISCO CORPORATION
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer dividing method
- Publication number 20070029684
- Publication date Feb 8, 2007
- DISCO CORPORATION
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of preparing terminal board
- Publication number 20060288826
- Publication date Dec 28, 2006
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for dividing semiconductor wafer along streets
- Publication number 20060073705
- Publication date Apr 6, 2006
- DISCO CORPORATION
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor wafer
- Publication number 20050233548
- Publication date Oct 20, 2005
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer processing method
- Publication number 20050221584
- Publication date Oct 6, 2005
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Application
Method of producing micro component
- Publication number 20050103635
- Publication date May 19, 2005
- Kazuhisa Arai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of manufacturing semiconductor wafer
- Publication number 20050106840
- Publication date May 19, 2005
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for processing soi substrate
- Publication number 20040241961
- Publication date Dec 2, 2004
- Toshiaki Takahashi
- B24 - GRINDING POLISHING
Information Patent Application
Flip chip bonder
- Publication number 20040206800
- Publication date Oct 21, 2004
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polishing material and method of polishing therewith
- Publication number 20040209554
- Publication date Oct 21, 2004
- Akio Tsumagari
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Machine for processing electrodes formed on a plate-like workpiece
- Publication number 20040208718
- Publication date Oct 21, 2004
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Application
Method for manufacturing semiconductor wafer
- Publication number 20040203187
- Publication date Oct 14, 2004
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer support plate
- Publication number 20040124413
- Publication date Jul 1, 2004
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor wafer and substrate
- Publication number 20040089958
- Publication date May 13, 2004
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer assembly and machining apparatus having chuck t...
- Publication number 20030181150
- Publication date Sep 25, 2003
- Kazuhisa Arai
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Method of grinding rear side of semiconductor wafer
- Publication number 20030027501
- Publication date Feb 6, 2003
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer dividing method
- Publication number 20030013380
- Publication date Jan 16, 2003
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer treating method and device for removing deposit...
- Publication number 20020045348
- Publication date Apr 18, 2002
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor chip pick-up method
- Publication number 20020025656
- Publication date Feb 28, 2002
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS

Kazuhisa Arai

Person

Patents Grantslast 30 patents

Resin sheet attaching method

Manufacturing method for photomask

Wafer dividing method

Grinding machine and method

Wafer processing method

Wafer dividing method

Optical device manufacturing method

Lamination device manufacturing method

Wafer processing method

Method of preparing terminal board

Flip chip bonder

Method of manufacturing semiconductor wafer

Wafer support plate

Semiconductor chip pick-up method

Method of grinding rear side of semiconductor wafer

Semiconductor wafer dividing method

Method of separating a plate-like workpiece held by adhesion on an...

Semiconductor wafer grinding method

Semiconductor wafer having regular or irregular chip pattern and di...

Semiconductor wafer cutting machine

Apparatus for grinding spherical objects

Patents Applicationslast 30 patents

WAFER PROCESSING METHOD

MANUFACTURING METHOD FOR PHOTOMASK

RESIN SHEET ATTACHING METHOD

WAFER DIVIDING METHOD

SEMICONDUCTOR DEVICE FABRICATION METHOD

METHOD OF CUTTING ADHESIVE FILM ON A SINGULATED WAFER BACKSIDE

GRINDING MACHINE AND METHOD

OPTICAL DEVICE MANUFACTURING METHOD

LAMINATION DEVICE MANUFACTURING METHOD

WAFER PROCESSING METHOD

Electronic device and manufacturing method therefor

Wafer dividing method

Method of preparing terminal board

Method for dividing semiconductor wafer along streets

Method for fabricating semiconductor wafer

Wafer processing method

Method of producing micro component

Method of manufacturing semiconductor wafer

Method for processing soi substrate

Flip chip bonder

Polishing material and method of polishing therewith

Machine for processing electrodes formed on a plate-like workpiece

Method for manufacturing semiconductor wafer

Wafer support plate

Conductor wafer and substrate

Semiconductor wafer assembly and machining apparatus having chuck t...

Method of grinding rear side of semiconductor wafer

Semiconductor wafer dividing method

Semiconductor wafer treating method and device for removing deposit...

Semiconductor chip pick-up method