Kazuhisa Sato

Person

Kounan, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 7,067,918
- Issue date Jun 27, 2006
- NGK Spark Plug Co., Ltd.
- Haruhiko Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board made of resin with pin
- Patent number 7,068,520
- Issue date Jun 27, 2006
- NGK Spark Plug Co., Ltd.
- Noritaka Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring substrates, metal plate for...
- Patent number 6,976,415
- Issue date Dec 20, 2005
- NGK Spark Plug Co., Ltd.
- Tomoe Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating printed-wiring substrate
- Patent number 6,887,512
- Issue date May 3, 2005
- NGK Spark Plug Co., Ltd.
- Hisashi Wakako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring substrates, metal plate for...
- Patent number 6,872,436
- Issue date Mar 29, 2005
- NGK Spark Plug Co. Ltd.
- Tomoe Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed-wiring substrate and method for fabricating the same
- Patent number 6,546,622
- Issue date Apr 15, 2003
- NGK Spark Plug Co., Ltd.
- Masahiro Iba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing a substrate and plating apparatus
- Patent number 6,495,211
- Issue date Dec 17, 2002
- NGK Spark Plug Co., Ltd.
- Masahiro Iba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired board and method of producing the same
- Patent number 6,486,551
- Issue date Nov 26, 2002
- NGK Spark Plug Co., Ltd.
- Kazuhisa Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed-wiring substrate and method for fabricating the printed-wir...
- Patent number 6,472,609
- Issue date Oct 29, 2002
- NGK Spark Plug Co., Ltd.
- Hisashi Wakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 6,225,569
- Issue date May 1, 2001
- NGK Spark Plug Co., Ltd.
- Hiroyuki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic IC package base and ceramic cover
- Patent number 5,798,566
- Issue date Aug 25, 1998
- NGK Spark Plug Co., Ltd.
- Kazuhisa Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Outer lead for a semiconductor IC package and a method of fabricati...
- Patent number 5,668,060
- Issue date Sep 16, 1997
- NGK Spark Plug Co., Ltd.
- Kazuhisa Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Outer lead for a semiconductor IC package having individually annea...
- Patent number 5,583,379
- Issue date Dec 10, 1996
- NGK Spark Plug Co., Ltd.
- Kazuhisa Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing printed wiring substrates, metal plate for...
- Publication number 20050155789
- Publication date Jul 21, 2005
- NGK SPARK PLUG CO., LTD.
- Tomoe Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Application
Multilayer wiring board, method of manufacturing the wiring board a...
- Publication number 20040238209
- Publication date Dec 2, 2004
- NGK SPARK PLUG CO., LTD.
- Shinji Yuri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board
- Publication number 20040227239
- Publication date Nov 18, 2004
- NGK SPARK PLUG CO., LTD.
- Haruhiko Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board made of resin with pin
- Publication number 20040129454
- Publication date Jul 8, 2004
- NGK SPARK PLUG CO., LTD.
- Noritaka Miyamoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for manufacturing printed wiring substrates, metal plate for...
- Publication number 20040018373
- Publication date Jan 29, 2004
- Tomoe Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed-wiring substrate and method for fabricating the printed-wir...
- Publication number 20020189860
- Publication date Dec 19, 2002
- NGK SPARK PLUG CO., LTD.
- Hisashi Wakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing a substrate and plating apparatus
- Publication number 20010053562
- Publication date Dec 20, 2001
- NGK SPARK PLUG CO., LTD.
- Masahiro Iba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed-wiring substrate and method for fabricating the same
- Publication number 20010052183
- Publication date Dec 20, 2001
- Masahiro Iba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed-wiring substrate and method for fabricating the printed-wir...
- Publication number 20010047881
- Publication date Dec 6, 2001
- NGK SPARK PLUG CO., LTD.
- Hisashi Wakako
- H01 - BASIC ELECTRIC ELEMENTS

Kazuhisa Sato

Person

Patents Grantslast 30 patents

Wiring board

Circuit board made of resin with pin

Method for manufacturing printed wiring substrates, metal plate for...

Method for fabricating printed-wiring substrate

Method for manufacturing printed wiring substrates, metal plate for...

Printed-wiring substrate and method for fabricating the same

Process for producing a substrate and plating apparatus

Wired board and method of producing the same

Printed-wiring substrate and method for fabricating the printed-wir...

Wiring substrate and method of manufacturing the same

Ceramic IC package base and ceramic cover

Outer lead for a semiconductor IC package and a method of fabricati...

Outer lead for a semiconductor IC package having individually annea...

Patents Applicationslast 30 patents

Method for manufacturing printed wiring substrates, metal plate for...

Multilayer wiring board, method of manufacturing the wiring board a...

Wiring board

Circuit board made of resin with pin

Method for manufacturing printed wiring substrates, metal plate for...

Printed-wiring substrate and method for fabricating the printed-wir...

Process for producing a substrate and plating apparatus

Printed-wiring substrate and method for fabricating the same

Printed-wiring substrate and method for fabricating the printed-wir...