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Kazuma Miura

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  • Yokohama, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Solder composition for electronic devices
    • Publication number 20070031279
    • Publication date Feb 8, 2007
    • Renesas Technology Corporation
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Solder foil semiconductor device and electronic device
    • Publication number 20060061974
    • Publication date Mar 23, 2006
    • Tasao Soga
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic apparatus
    • Publication number 20040177997
    • Publication date Sep 16, 2004
    • Hanae Hata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor device having solder bumps reliably reflow solderable
    • Publication number 20030030149
    • Publication date Feb 13, 2003
    • Kazuma Miura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic device
    • Publication number 20020171157
    • Publication date Nov 21, 2002
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Product using Zn-Al alloy solder
    • Publication number 20020149114
    • Publication date Oct 17, 2002
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Electronic device
    • Publication number 20020114726
    • Publication date Aug 22, 2002
    • Hitachi, Ltd
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Electronic device
    • Publication number 20020100986
    • Publication date Aug 1, 2002
    • Hitachi, Ltd
    • Tasao Soga
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Semiconductor module and circuit substrate
    • Publication number 20010050181
    • Publication date Dec 13, 2001
    • Kazuma Miura
    • H01 - BASIC ELECTRIC ELEMENTS