Kazumi Ikeda

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Mitaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for chamfering wafer
- Patent number 6,431,961
- Issue date Aug 13, 2002
- Tokyo Seimitsu Co., Ltd.
- Ichiro Katayama
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for chamfering wafer
- Patent number 6,267,648
- Issue date Jul 31, 2001
- Tokyo Seimitsu Co. Ltd.
- Ichiro Katayama
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer chamfering method and apparatus
- Patent number 6,066,031
- Issue date May 23, 2000
- Tokyo Seimitsu Co., Ltd.
- Etsuo Noguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer positioning method and apparatus
- Patent number 6,062,953
- Issue date May 16, 2000
- Tokyo Seimitsu Co., Ltd.
- Jun Takaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR