Kazunori Hayata

Person

Minami-Alps City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit substrate interconnect
- Patent number 9,536,753
- Issue date Jan 3, 2017
- Texas Instruments Incorporated
- Yohei Koto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step sintering of metal paste for semiconductor device wire b...
- Patent number 8,815,648
- Issue date Aug 26, 2014
- Texas Instruments Incorporated
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for contacting agglomerate terminals of semiconductor packages
- Patent number 8,716,068
- Issue date May 6, 2014
- Texas Instruments Incorporated
- Darvin R. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having agglomerate terminals
- Patent number 8,643,165
- Issue date Feb 4, 2014
- Texas Instruments Incorporated
- Darvin R. Edwards
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT SUBSTRATE INTERCONNECT
- Publication number 20160099226
- Publication date Apr 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Yohei Koto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Die And Package
- Publication number 20150340324
- Publication date Nov 26, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Kazunori Hayata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING REINFORCED WIRE BONDS TO METAL TERMINALS
- Publication number 20140284779
- Publication date Sep 25, 2014
- TEXAS INSTRUMENTS INCORPORATED
- KAZUNORI HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING
- Publication number 20140091465
- Publication date Apr 3, 2014
- TEXAS INSTRUMENTS INCORPORATED
- KAZUNORI HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES
- Publication number 20140038358
- Publication date Feb 6, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Darvin R. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES
- Publication number 20120211889
- Publication date Aug 23, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Darvin R. EDWARDS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Manufacturing Method
- Publication number 20100255641
- Publication date Oct 7, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Noboru NAKANISHI
- H01 - BASIC ELECTRIC ELEMENTS

Kazunori Hayata

Person

Patents Grantslast 30 patents

Circuit substrate interconnect

Multi-step sintering of metal paste for semiconductor device wire b...

Method for contacting agglomerate terminals of semiconductor packages

Semiconductor device having agglomerate terminals

Patents Applicationslast 30 patents

CIRCUIT SUBSTRATE INTERCONNECT

Integrated Circuit Die And Package

SEMICONDUCTOR DEVICE HAVING REINFORCED WIRE BONDS TO METAL TERMINALS

LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING

METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES

METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES

Semiconductor Manufacturing Method