Kazunori Imaoka

Person

Komae, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having interlayer insulator and method for fab...
- Patent number 6,232,663
- Issue date May 15, 2001
- Fujitsu Limited
- Toshio Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having SOI substrate and fabrication method th...
- Patent number 5,498,893
- Issue date Mar 12, 1996
- Fujitsu Limited
- Shouji Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor devices using an intermediate g...
- Patent number 5,426,073
- Issue date Jun 20, 1995
- Fujitsu Limited
- Kazunori Imaoka
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device having silicon-on-insulator structure
- Patent number 5,250,836
- Issue date Oct 5, 1993
- Fujitsu Limited
- Takao Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a metal-oxide-semiconductor device having a s...
- Patent number 5,238,857
- Issue date Aug 24, 1993
- Fujitsu Limited
- Noriaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor-on-insulator structure by besol p...
- Patent number 5,231,045
- Issue date Jul 27, 1993
- Fujitsu Limited
- Takao Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a SOI substrate and fabrication method...
- Patent number 5,162,254
- Issue date Nov 10, 1992
- Fujitsu Limited
- Shouji Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having trench isolation
- Patent number 5,148,247
- Issue date Sep 15, 1992
- Fujitsu Limited
- Takao Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a semiconductor device with a bulk-defect reg...
- Patent number 5,094,963
- Issue date Mar 10, 1992
- Fujitsu Limited
- Takao Hiraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a BIC memory cell having contact openings with str...
- Patent number 5,075,249
- Issue date Dec 24, 1991
- Fujitsu Limited
- Noriaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having semiconductor-on-insulator structure
- Patent number 5,066,993
- Issue date Nov 19, 1991
- Fujitsu Limited
- Takao Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using SOI substrate
- Patent number 5,017,998
- Issue date May 21, 1991
- Fujitsu Limited
- Takao Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a process for producing a semiconductor de...
- Patent number 4,970,568
- Issue date Nov 13, 1990
- Fujitsu Limited
- Takao Hiraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved isolation between trench capacitors
- Patent number 4,918,499
- Issue date Apr 17, 1990
- Fujitsu Limited
- Takeshi Matsutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming planar wiring using polysilicon to fill gaps
- Patent number 4,801,559
- Issue date Jan 31, 1989
- Fujitsu Limited
- Kazunori Imaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming denuded zone in wafer by intrinsic gettering and...
- Patent number 4,597,804
- Issue date Jul 1, 1986
- Fujitsu Limited
- Kazunori Imaoka
- H01 - BASIC ELECTRIC ELEMENTS

Kazunori Imaoka

Person

Patents Grantslast 30 patents

Semiconductor device having interlayer insulator and method for fab...

Semiconductor device having SOI substrate and fabrication method th...

Method of fabricating semiconductor devices using an intermediate g...

Semiconductor device having silicon-on-insulator structure

Method of fabricating a metal-oxide-semiconductor device having a s...

Method of producing semiconductor-on-insulator structure by besol p...

Semiconductor device having a SOI substrate and fabrication method...

Semiconductor device having trench isolation

Process for producing a semiconductor device with a bulk-defect reg...

Method of making a BIC memory cell having contact openings with str...

Semiconductor device having semiconductor-on-insulator structure

Semiconductor device using SOI substrate

Semiconductor device and a process for producing a semiconductor de...

Semiconductor device with improved isolation between trench capacitors

Process for forming planar wiring using polysilicon to fill gaps

Methods of forming denuded zone in wafer by intrinsic gettering and...