Kazuto Tsuji

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Package, electronic device, substrate having a separation region an...
- Patent number 7,923,835
- Issue date Apr 12, 2011
- Fujitsu Semiconductor Limited
- Yoshihiro Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,476,811
- Issue date Jan 13, 2009
- Fujitsu Limited
- Yoshihiro Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,361,980
- Issue date Apr 22, 2008
- Fujitsu Limited
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat spreader exposed from a seal resin
- Patent number 7,193,320
- Issue date Mar 20, 2007
- Fujitsu Limited
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having resin package and method of producing the same
- Patent number 7,144,754
- Issue date Dec 5, 2006
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,042,102
- Issue date May 9, 2006
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having resin package and method of producing the same
- Patent number 6,856,017
- Issue date Feb 15, 2005
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for making the same
- Patent number 6,798,031
- Issue date Sep 28, 2004
- Fujitsu Limited
- Toshiyuki Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module including a plurality of semiconductor devices...
- Patent number 6,696,754
- Issue date Feb 24, 2004
- Fujitsu Limited
- Mitsutaka Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method for fabricating the semiconductor devi...
- Patent number 6,573,121
- Issue date Jun 3, 2003
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonded device with ball-shaped bonds
- Patent number 6,495,773
- Issue date Dec 17, 2002
- Fujitsu Limited
- Ryuji Nomoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module including a plurality of semiconductor devices...
- Patent number 6,472,744
- Issue date Oct 29, 2002
- Fujitsu Limited
- Mitsutaka Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for fabricating the semiconductor devi...
- Patent number 6,376,921
- Issue date Apr 23, 2002
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having resin encapsulated package structure
- Patent number 6,271,583
- Issue date Aug 7, 2001
- Fujitsu Limited
- Hideharu Sakoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a lead portion with outer connecting te...
- Patent number 6,255,740
- Issue date Jul 3, 2001
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 6,191,494
- Issue date Feb 20, 2001
- Fujitsu Limited
- Nobuo Ooyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fabricating semiconductor device
- Patent number 6,159,770
- Issue date Dec 12, 2000
- Fujitsu Limited
- Masafumi Tetaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having resin package with projections
- Patent number 6,072,239
- Issue date Jun 6, 2000
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 6,069,408
- Issue date May 30, 2000
- Fujitsu Limited
- Toshiyuki Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a frame terminal
- Patent number 6,025,650
- Issue date Feb 15, 2000
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device
- Patent number 5,930,603
- Issue date Jul 27, 1999
- Fujitsu Limited
- Kazuto Tsuji
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device suitable for testing
- Patent number 5,904,506
- Issue date May 18, 1999
- Fujitsu Limited
- Yoshiyuki Yoneda
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 5,891,758
- Issue date Apr 6, 1999
- Fujitsu Limited, Ltd.
- Toshiyuki Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for surface mounting
- Patent number 5,861,669
- Issue date Jan 19, 1999
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method, semiconductor device, capillary for wire bondi...
- Patent number 5,842,628
- Issue date Dec 1, 1998
- Fujitsu Limited
- Ryuji Nomoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package for surface mounting
- Patent number 5,831,332
- Issue date Nov 3, 1998
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having resin encapsulated package structure
- Patent number 5,808,357
- Issue date Sep 15, 1998
- Fujitsu Limited
- Hideharu Sakoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a packaged semiconductor having a divided...
- Patent number 5,804,468
- Issue date Sep 8, 1998
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device unit
- Patent number 5,786,985
- Issue date Jul 28, 1998
- Fujitsu Limited
- Norio Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device suitable for testing
- Patent number 5,767,527
- Issue date Jun 16, 1998
- Fujitsu Limited
- Yoshiyuki Yoneda
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20080174005
- Publication date Jul 24, 2008
- Fujitsu Limited
- Yoshihiro Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20070221978
- Publication date Sep 27, 2007
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a heat spreader exposed from a seal resin
- Publication number 20070114642
- Publication date May 24, 2007
- Fujitsu Limited
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20060137902
- Publication date Jun 29, 2006
- FUJITSU LIMITED
- Yoshihiro Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20050280034
- Publication date Dec 22, 2005
- FUJITSU LIMITED
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050269701
- Publication date Dec 8, 2005
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device having resin package and method of producing the same
- Publication number 20040219719
- Publication date Nov 4, 2004
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device having a heat spreader exposed from a seal resin
- Publication number 20030222344
- Publication date Dec 4, 2003
- FUJITSU LIMITED
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module including a plurality of semiconductor devices...
- Publication number 20030164544
- Publication date Sep 4, 2003
- FUJITSU LIMITED
- Mitsutaka Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for making the same
- Publication number 20030071342
- Publication date Apr 17, 2003
- FUJITSU LIMITED
- Toshiyuki Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING RESIN PACKAGE AND METHOD OF PRODUCING THE SAME
- Publication number 20030006503
- Publication date Jan 9, 2003
- YOSHIYUKI YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for making the same
- Publication number 20020119658
- Publication date Aug 29, 2002
- FUJITSU LIMITED
- Toshiyuki Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for fabricating the semiconductor devi...
- Publication number 20020027265
- Publication date Mar 7, 2002
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE INCLUDING A PLURALITY OF SEMICONDUCTOR DEVICES...
- Publication number 20020000645
- Publication date Jan 3, 2002
- MITSUTAKA SATO
- H01 - BASIC ELECTRIC ELEMENTS

Kazuto Tsuji

Person

Patents Grantslast 30 patents

Package, electronic device, substrate having a separation region an...

Semiconductor device and manufacturing method therefor

Semiconductor device

Semiconductor device having a heat spreader exposed from a seal resin

Device having resin package and method of producing the same

Semiconductor device

Device having resin package and method of producing the same

Semiconductor device and method for making the same

Semiconductor module including a plurality of semiconductor devices...

Semiconductor device, method for fabricating the semiconductor devi...

Wire bonded device with ball-shaped bonds

Semiconductor module including a plurality of semiconductor devices...

Semiconductor device, method for fabricating the semiconductor devi...

Semiconductor device having resin encapsulated package structure

Semiconductor device having a lead portion with outer connecting te...

Semiconductor device and method of producing the same

Method and apparatus for fabricating semiconductor device

Device having resin package with projections

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device including a frame terminal

Method for producing a semiconductor device

Semiconductor device suitable for testing

Semiconductor device and method for manufacturing semiconductor device

Semiconductor package for surface mounting

Wire bonding method, semiconductor device, capillary for wire bondi...

Semiconductor package for surface mounting

Semiconductor device having resin encapsulated package structure

Process for manufacturing a packaged semiconductor having a divided...

Semiconductor device and semiconductor device unit

Semiconductor device suitable for testing

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Semiconductor device

Semiconductor device having a heat spreader exposed from a seal resin

Semiconductor device and manufacturing method therefor

Semiconductor device

Semiconductor device

Device having resin package and method of producing the same

Semiconductor device having a heat spreader exposed from a seal resin

Semiconductor module including a plurality of semiconductor devices...

Semiconductor device and method for making the same

DEVICE HAVING RESIN PACKAGE AND METHOD OF PRODUCING THE SAME

Semiconductor device and method for making the same

Semiconductor device, method for fabricating the semiconductor devi...

SEMICONDUCTOR MODULE INCLUDING A PLURALITY OF SEMICONDUCTOR DEVICES...