Claims
- 1. A semiconductor device comprising:
- a semiconductor chip;
- a resin package for sealing said semiconductor chip;
- electrode members embedded in and held by said resin package and partly exposed from a mounting surface so as to form external connection terminals, each of said electrode members being made of a single-piece metal member having a rectangular shape viewed in a direction parallel to a mounting board; and
- connecting parts electrically connecting electrode pads on said semiconductor chip with said electrode members.
- 2. The semiconductor device as claimed in claim 1, further comprising a spacer on a lower surface of said semiconductor chip, said spacer having an area smaller than an area of said semiconductor device, and a sealing resin forming said resin package surrounds said spacer.
- 3. The semiconductor device as claimed in claim 1, wherein said electrode members extend outside an outer edge of said resin package.
- 4. The semiconductor device as claimed in claim 1, wherein said electrode members include high-back electrode members and low-back electrode members having a height lower than a height of said high-back electrode members.
- 5. The semiconductor device as claimed in claim 1, further comprising plating layers which are at least partly formed on said electrode members.
- 6. The semiconductor device as claimed in claim 1, wherein said electrode members are made of one of solder and gold.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9-152678 |
Jun 1997 |
JPX |
|
Parent Case Info
This application is a Division of prior application Ser. No. 08/962,395 filed Oct. 31, 1997, now U.S. Pat. No. 5,891,758.
US Referenced Citations (7)
Divisions (1)
|
Number |
Date |
Country |
Parent |
962395 |
Oct 1997 |
|