Kazutoshi Tomiyoshi

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting epoxy resin composition and semiconductor device
- Patent number 9,303,115
- Issue date Apr 5, 2016
- Nichia Corporation
- Masaki Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silicone resin composition for optical semiconductor devices
- Patent number 8,022,137
- Issue date Sep 20, 2011
- Shin-Etsu Chemical Co., Ltd.
- Yusuke Taguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
White thermosetting silicone resin composition for molding an optic...
- Patent number 8,013,057
- Issue date Sep 6, 2011
- Shin-Etsu Chemical Co., Ltd.
- Yusuke Taguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
White heat-curable silicone resin composition, optoelectronic part...
- Patent number 8,013,056
- Issue date Sep 6, 2011
- Shin-Etsu Chemical Co., Ltd.
- Yusuke Taguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor-encapsulating epoxy resin composition, preparation me...
- Patent number 7,910,638
- Issue date Mar 22, 2011
- Shin-Etsu Chemical Co., Ltd.
- Tomoyoshi Tada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating flame retardant epoxy resin composition...
- Patent number 7,122,587
- Issue date Oct 17, 2006
- Shin-Etsu Chemical Co., Ltd.
- Tarou Shimoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 7,095,125
- Issue date Aug 22, 2006
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,894,091
- Issue date May 17, 2005
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating flame retardant epoxy resin composition...
- Patent number 6,783,859
- Issue date Aug 31, 2004
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,723,452
- Issue date Apr 20, 2004
- Shin-Etsu Chemical Co., Ltd.
- Yasuo Kimura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,630,745
- Issue date Oct 7, 2003
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin compositions and premolded semiconductor packages
- Patent number 6,569,532
- Issue date May 27, 2003
- Sony Corporation
- Kazutoshi Tomiyoshi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin compositions, and semicondu...
- Patent number 6,518,332
- Issue date Feb 11, 2003
- Shin-Etsu Chemical Co., Ltd.
- Eiichi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin compositions and premolded semiconductor packages
- Patent number 6,399,677
- Issue date Jun 4, 2002
- Shin-Etsu Chemical Co., Ltd.
- Kazutoshi Tomiyoshi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,297,306
- Issue date Oct 2, 2001
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,291,556
- Issue date Sep 18, 2001
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,274,251
- Issue date Aug 14, 2001
- Hokko Chemical Industry Co., Ltd.
- Kenji Ohashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin compositions, and semicondu...
- Patent number 6,231,997
- Issue date May 15, 2001
- Shin-Etsu Chemical Co., Ltd.
- Kazuhiro Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic filler, epoxy resin composition, and semiconductor device
- Patent number 6,207,296
- Issue date Mar 27, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Noriaki Higuchi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,177,489
- Issue date Jan 23, 2001
- Shin-Etsu Chemical Co., Ltd.
- Satoshi Okuse
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,168,872
- Issue date Jan 2, 2001
- Hokko Chemical Industry Co., Ltd.
- Kenji Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,162,878
- Issue date Dec 19, 2000
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,160,078
- Issue date Dec 12, 2000
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin compositions, and semicondu...
- Patent number 6,139,978
- Issue date Oct 31, 2000
- Shin-Etsu Chemical Co., Ltd.
- Kazuhiro Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant of crystalline epoxy resin and phenolic resin-crystalli...
- Patent number 6,027,812
- Issue date Feb 22, 2000
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition
- Patent number 6,001,901
- Issue date Dec 14, 1999
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition and semiconductor device encapsulated there...
- Patent number 5,940,688
- Issue date Aug 17, 1999
- Shin-Etsu Chemical Co., Ltd.
- Noriaki Higuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Inorganic filler, epoxy resin composition, and semiconductor device
- Patent number 5,935,314
- Issue date Aug 10, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Noriaki Higuchi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Epoxy resin compositions and semiconductor devices encapsulated the...
- Patent number 5,418,266
- Issue date May 23, 1995
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Naphthol novolac epoxy resin compositions and semiconductor devices...
- Patent number 5,358,980
- Issue date Oct 25, 1994
- Shin-Etsu Chemical Company, Limited
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20100148380
- Publication date Jun 17, 2010
- Masaki Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILICONE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES
- Publication number 20100081748
- Publication date Apr 1, 2010
- Yusuke TAGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WHITE THERMOSETTING SILICONE RESIN COMPOSITION FOR MOLDING AN OPTIC...
- Publication number 20090239997
- Publication date Sep 24, 2009
- Yusuke TAGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION, PREPARATION ME...
- Publication number 20090192258
- Publication date Jul 30, 2009
- Shin-Etsu Chemical Co., Ltd.
- Tomoyoshi Tada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION, OPTOELECTRONIC PART...
- Publication number 20090171013
- Publication date Jul 2, 2009
- Yusuke TAGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating flame retardant epoxy resin composition...
- Publication number 20040072968
- Publication date Apr 15, 2004
- Tarou Shimoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20040034161
- Publication date Feb 19, 2004
- SHIN-ETSU CHEMICAL CO. LTD
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating flame retardant epoxy resin composition...
- Publication number 20030152777
- Publication date Aug 14, 2003
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20030050399
- Publication date Mar 13, 2003
- Yasuo Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor encapsulating epoxy resin compositions, and semicondu...
- Publication number 20020102429
- Publication date Aug 1, 2002
- Shin-Etsu Chemical Co., Ltd.
- Eiichi Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy resin compositions and premolded semiconductor packages
- Publication number 20020076558
- Publication date Jun 20, 2002
- Shin-Etsu Company Co., Ltd.
- Kazutoshi Tomiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20020016398
- Publication date Feb 7, 2002
- Shoichi Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy resin compositions and premolded semiconductor packages
- Publication number 20010004651
- Publication date Jun 21, 2001
- Kazutoshi Tomiyoshi
- H01 - BASIC ELECTRIC ELEMENTS

Kazutoshi Tomiyoshi

Person

Patents Grantslast 30 patents

Thermosetting epoxy resin composition and semiconductor device

Silicone resin composition for optical semiconductor devices

White thermosetting silicone resin composition for molding an optic...

White heat-curable silicone resin composition, optoelectronic part...

Semiconductor-encapsulating epoxy resin composition, preparation me...

Semiconductor encapsulating flame retardant epoxy resin composition...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating flame retardant epoxy resin composition...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Epoxy resin compositions and premolded semiconductor packages

Semiconductor encapsulating epoxy resin compositions, and semicondu...

Epoxy resin compositions and premolded semiconductor packages

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin compositions, and semicondu...

Inorganic filler, epoxy resin composition, and semiconductor device

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin compositions, and semicondu...

Encapsulant of crystalline epoxy resin and phenolic resin-crystalli...

Epoxy resin composition

Epoxy resin composition and semiconductor device encapsulated there...

Inorganic filler, epoxy resin composition, and semiconductor device

Epoxy resin compositions and semiconductor devices encapsulated the...

Naphthol novolac epoxy resin compositions and semiconductor devices...

Patents Applicationslast 30 patents

THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

SILICONE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES

WHITE THERMOSETTING SILICONE RESIN COMPOSITION FOR MOLDING AN OPTIC...

SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION, PREPARATION ME...

WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION, OPTOELECTRONIC PART...

Semiconductor encapsulating flame retardant epoxy resin composition...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating flame retardant epoxy resin composition...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin compositions, and semicondu...

Epoxy resin compositions and premolded semiconductor packages

Semiconductor encapsulating epoxy resin composition and semiconduct...

Epoxy resin compositions and premolded semiconductor packages