Kazuyoshi Amami

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing mounting structure and mounting structure produ...
- Patent number 6,818,461
- Issue date Nov 16, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including wiring board with three dimensional...
- Patent number 6,756,663
- Issue date Jun 29, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for planarizing circuit board and method for manufacturing s...
- Patent number 6,723,251
- Issue date Apr 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Minehiro Itagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for planarizing circuit board and method for manufacturing s...
- Patent number 6,703,262
- Issue date Mar 9, 2004
- Matsushita Electric Industrial Co., Ltd.
- Minehiro Itagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including a wiring board and semiconductor ele...
- Patent number 6,525,414
- Issue date Feb 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive composition, conductive adhesive, and their mounting str...
- Patent number 6,468,448
- Issue date Oct 22, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrical mounting structure having an elution preventive film
- Patent number 6,429,382
- Issue date Aug 6, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic circuit component molding device
- Patent number 5,364,253
- Issue date Nov 15, 1994
- Matsushita Electric Industrial Co., Ltd.
- Kiyoshi Kojima
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device including a wiring board with a three-dimensio...
- Publication number 20040212075
- Publication date Oct 28, 2004
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and module of the same
- Publication number 20030094685
- Publication date May 22, 2003
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for planarizing circuit board and method for manufacturing s...
- Publication number 20030092327
- Publication date May 15, 2003
- MINEHIRO ITAGAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of producing mounting structure and mounting structure produ...
- Publication number 20020072151
- Publication date Jun 13, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazuyoshi Amami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLANARIZING CIRCUIT BOARD AND METHOD FOR MANUFACTURING S...
- Publication number 20010029066
- Publication date Oct 11, 2001
- MINEHIRO ITAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and module of the same
- Publication number 20010002727
- Publication date Jun 7, 2001
- Tsukasa Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS

Kazuyoshi Amami

Person

Patents Grantslast 30 patents

Method of producing mounting structure and mounting structure produ...

Semiconductor device including wiring board with three dimensional...

Method for planarizing circuit board and method for manufacturing s...

Method for planarizing circuit board and method for manufacturing s...

Semiconductor device including a wiring board and semiconductor ele...

Conductive composition, conductive adhesive, and their mounting str...

Electrical mounting structure having an elution preventive film

Magnetic circuit component molding device

Patents Applicationslast 30 patents

Semiconductor device including a wiring board with a three-dimensio...

Semiconductor device and module of the same

Method for planarizing circuit board and method for manufacturing s...

Method of producing mounting structure and mounting structure produ...

METHOD FOR PLANARIZING CIRCUIT BOARD AND METHOD FOR MANUFACTURING S...

Semiconductor device and module of the same