Keiichi Iwata

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Niigata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Process for the production of high-density printed wiring board
- Patent number 7,140,103
- Issue date Nov 28, 2006
- Mitsubishi Gas Chemical Company, Inc.
- Morio Gaku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Developing solution for a photoresist and a method for developing t...
- Patent number 6,602,654
- Issue date Aug 5, 2003
- Mitsubishi Gas Chemical Company, Inc.
- Keiichi Iwata
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Removing agent composition for a photoresist and process for produc...
- Patent number 5,846,695
- Issue date Dec 8, 1998
- Mitsubishi Gas Chemical Company, Inc.
- Keiichi Iwata
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Removing agent composition for photoresist and method of removing
- Patent number 5,567,574
- Issue date Oct 22, 1996
- Mitsubishi Gas Chemical Company, Inc.
- Ryuji Hasemi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
Process for the production of high-density printed wiring board
- Publication number 20030049913
- Publication date Mar 13, 2003
- Morio Gaku
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Developing solution for a photoresist and a method for developing t...
- Publication number 20020132193
- Publication date Sep 19, 2002
- Keiichi Iwata
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY