Keiichi Kajiyama

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Dividing method for wafer having die bonding film attached to the b...
- Patent number 8,415,232
- Issue date Apr 9, 2013
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device wafer processing method
- Patent number 8,268,656
- Issue date Sep 18, 2012
- Disco Corporation
- Keiichi Kajiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of grinding wafer
- Patent number 8,025,556
- Issue date Sep 27, 2011
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer processing method
- Patent number 7,858,496
- Issue date Dec 28, 2010
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method for wafer and processing apparatus therefor
- Patent number 7,858,530
- Issue date Dec 28, 2010
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 7,816,264
- Issue date Oct 19, 2010
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method for wafer
- Patent number 7,718,511
- Issue date May 18, 2010
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grinding method for wafer
- Patent number 7,677,955
- Issue date Mar 16, 2010
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer processing method
- Patent number 7,629,230
- Issue date Dec 8, 2009
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 7,625,810
- Issue date Dec 1, 2009
- Disco Corporation
- Keiichi Kajiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 7,527,547
- Issue date May 5, 2009
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Grant
Process for manufacturing a semiconductor chip
- Patent number 6,939,785
- Issue date Sep 6, 2005
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making electrodeposition blades
- Patent number 6,306,274
- Issue date Oct 23, 2001
- Disco Corporation
- Keiichi Kajiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of effecting a precision saw-toothed grinding on the surface...
- Patent number 6,171,176
- Issue date Jan 9, 2001
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Grant
Electrodeposited grinding tool
- Patent number 4,547,998
- Issue date Oct 22, 1985
- Disco Abrasive Systems, Ltd.
- Keiichi Kajiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
DIVIDING METHOD FOR WAFER HAVING DIE BONDING FILM ATTACHED TO THE B...
- Publication number 20120100694
- Publication date Apr 26, 2012
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20110097875
- Publication date Apr 28, 2011
- Disco Corporation
- Yohei Gokita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE WAFER PROCESSING METHOD
- Publication number 20100267219
- Publication date Oct 21, 2010
- Disco Corporation
- Keiichi Kajiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20100055877
- Publication date Mar 4, 2010
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF GRINDING WAFER
- Publication number 20090186562
- Publication date Jul 23, 2009
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING METHOD FOR WAFER
- Publication number 20090098808
- Publication date Apr 16, 2009
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Application
Wafer processing method
- Publication number 20090042368
- Publication date Feb 12, 2009
- DISCO CORPORATION
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20090017623
- Publication date Jan 15, 2009
- Disco Corporation
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer processing method
- Publication number 20070264912
- Publication date Nov 15, 2007
- DISCO CORPORATION
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Application
Processing method for wafer
- Publication number 20070231929
- Publication date Oct 4, 2007
- DISCO CORPORATION
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processing method for wafer and processing apparatus therefor
- Publication number 20070227655
- Publication date Oct 4, 2007
- DISCO CORPORATION
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer processing method
- Publication number 20060292826
- Publication date Dec 28, 2006
- DISCO CORPORATION
- Keiichi Kajiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor wafer processing method and processing apparatus
- Publication number 20060094210
- Publication date May 4, 2006
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer processing method and processing apparatus
- Publication number 20050054274
- Publication date Mar 10, 2005
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Application
Process for manufacturing a semiconductor chip
- Publication number 20040266138
- Publication date Dec 30, 2004
- Keiichi Kajiyama
- H01 - BASIC ELECTRIC ELEMENTS

Keiichi Kajiyama

Person

Patents Grantslast 30 patents

Dividing method for wafer having die bonding film attached to the b...

Optical device wafer processing method

Method of grinding wafer

Wafer processing method

Processing method for wafer and processing apparatus therefor

Wafer processing method

Processing method for wafer

Grinding method for wafer

Wafer processing method

Wafer processing method

Wafer processing method

Process for manufacturing a semiconductor chip

Method for making electrodeposition blades

Method of effecting a precision saw-toothed grinding on the surface...

Electrodeposited grinding tool

Patents Applicationslast 30 patents

DIVIDING METHOD FOR WAFER HAVING DIE BONDING FILM ATTACHED TO THE B...

WAFER PROCESSING METHOD

OPTICAL DEVICE WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

METHOD OF GRINDING WAFER

GRINDING METHOD FOR WAFER

Wafer processing method

WAFER PROCESSING METHOD

Wafer processing method

Processing method for wafer

Processing method for wafer and processing apparatus therefor

Wafer processing method

Semiconductor wafer processing method and processing apparatus

Semiconductor wafer processing method and processing apparatus

Process for manufacturing a semiconductor chip