Processing method for wafer and processing apparatus therefor

Abstract

A processing method for a wafer includes: preparing a wafer which has a device region having plural devices formed on a surface of the wafer; and a peripheral reinforcing portion which is integrally formed around the device region and has a projection projecting outwardly on a rear surface of the wafer. The processing method further includes: removing at least the projection of the peripheral reinforcing portion of the wafer; and transferring the wafer after the removing. In the removing, while the wafer is held on a holding table such that the rear surface of the wafer is exposed and the surface of the wafer closely contacts the holding table, at least the projection of the peripheral reinforcing portion is removed. After the removing of at least the projection, while the wafer is held on the holding table, a holding tape is applied to the rear surface of the wafer and the holding tape is supported by a frame. In the transferring, the wafer having the holding tape applied thereon is separated together with the frame from the holding table and is transferred together with the frame.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1C are a surface side perspective view, a rear surface side perspective view, and a cross sectional view which show a wafer processed in an embodiment according to the present invention.

FIG. 2 is an overall perspective view of a wafer processing apparatus of an embodiment according to the present invention.

FIG. 3 is a plan view of the wafer processing apparatus shown in FIG. 2.

FIG. 4 is a plan view which shows a wafer hand of wafer supply section of the wafer processing apparatus.

FIGS. 5A to 5D are side views which show actions of the wafer hand in turn.

FIG. 6 is a perspective view which shows a condition in which a peripheral reinforcing portion of the wafer is ground by a grinding unit of wafer grinding section.

FIG. 7 is a side view of FIG. 6.

FIGS. 8A and 8B are a plan view and a cross sectional view which show a dicing tape and a dicing frame.

FIGS. 9A to 9C are side views which show a process in turn, in which the dicing tape is applied to the rear surface of the wafer by a pressing roller.

FIG. 10 is an overall perspective view of a wafer processing apparatus of another embodiment according to the present invention.

FIG. 11 is a plan view which shows the wafer processing apparatus shown in FIG. 10.

FIG. 12 is a side view which shows a condition in which a peripheral reinforcing portion of a wafer is cut by a cutting blade of the wafer processing apparatus of the another embodiment according to the present invention.

FIGS. 13A to 13H are side views which show an example of the action of the cutting blade in turn, the cutting blade cutting a peripheral reinforcing portion of the wafer.;

Claims

1. A processing method for a wafer, comprising: preparing a wafer which has a device region having plural devices formed on a surface of the wafer; and a peripheral reinforcing portion which is integrally formed around the device region and has a projection projecting outwardly on a rear surface of the wafer;removing at least the projection of the peripheral reinforcing portion of the wafer; andtransferring the wafer after the removing,wherein in the removing, while the wafer is held on a holding table such that the rear surface of the wafer is exposed and the surface of the wafer closely contacts the holding table, at least the projection of the peripheral reinforcing portion is removed,after the removing of at least the projection, while the wafer is held on the holding table, a holding tape is applied to the rear surface of the wafer and the holding tape is supported by a frame, andin the transferring, the wafer having the holding tape applied thereon is separated together with the frame from the holding table and is transferred together with the frame.

2. A processing method for a wafer according to claim 1, wherein the frame is integrally applied to the holding tape beforehand.

3. A processing method for a wafer according to claim 1, wherein a metal film is provided to a region of the rear surface which corresponds to the device region.

4. A processing method for a wafer according to claim 1, wherein after the removing of at least the projection of the peripheral reinforcing portion of the wafer, while the wafer is held on the holding table, the wafer is cleaned, andafter the cleaning of the wafer, the holding tape is applied to the rear surface of the wafer.

5. A processing apparatus for a wafer, the wafer comprising:a device region which has plural devices formed on a surface of the wafer; anda peripheral reinforcing portion which is integrally formed around the device region and has a projection projecting outwardly on a rear surface of the wafer,the processing apparatus comprising:a holding table for holding the wafer while the rear surface of the wafer is exposed and the surface of the wafer closely contacts the holding table;a peripheral reinforcing portion removing device for removing at least the projection of the peripheral reinforcing portion of the wafer; anda holding tape applying device for applying a holding tape to the rear surface of the wafer and supporting the holding tape by a frame,wherein after at least the projection of the peripheral reinforcing portion is removed by the peripheral reinforcing portion removing device, the wafer on which the holding tape is applied by the holding tape applying device is transferred together with the frame.

6. A processing apparatus for a wafer according to claim 5, wherein the processing apparatus further comprising:a cleaning device for cleaning the wafer, of which at least the projection of the peripheral reinforcing portion is removed, while the wafer is held on the holding table.