Keiichi Kurashina

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus
- Patent number 11,024,520
- Issue date Jun 1, 2021
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 10,468,274
- Issue date Nov 5, 2019
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate transfer method
- Patent number 10,141,211
- Issue date Nov 27, 2018
- Ebara Corporation
- Toshio Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of transferring a substrate
- Patent number 9,786,532
- Issue date Oct 10, 2017
- Ebara Corporation
- Toshio Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching liquid, etching method, and method of manufacturing solder...
- Patent number 9,633,898
- Issue date Apr 25, 2017
- Ebara Corporation
- Akira Susaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 9,556,533
- Issue date Jan 31, 2017
- Ebara Corporation
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 8,029,653
- Issue date Oct 4, 2011
- Ebara Corporation
- Satoru Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 7,736,474
- Issue date Jun 15, 2010
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus and plating method
- Patent number 7,553,400
- Issue date Jun 30, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and plating apparatus
- Patent number 7,479,213
- Issue date Jan 20, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus for substrate
- Patent number 7,311,809
- Issue date Dec 25, 2007
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE AND THE SAME SUBSTRATE
- Publication number 20200335394
- Publication date Oct 22, 2020
- EBARA CORPORATION
- Keiichi KURASHINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20200027758
- Publication date Jan 23, 2020
- EBARA CORPORATION
- Keiichi KURASHINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20200027759
- Publication date Jan 23, 2020
- EBARA CORPORATION
- Keiichi KURASHINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANFSER METHOD
- Publication number 20170358472
- Publication date Dec 14, 2017
- EBARA CORPORATION
- Toshio YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20160284571
- Publication date Sep 29, 2016
- EBARA CORPORATION
- Keiichi KURASHINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING LIQUID, ETCHING METHOD, AND METHOD OF MANUFACTURING SOLDER...
- Publication number 20160042993
- Publication date Feb 11, 2016
- EBARA CORPORATION
- Akira SUSAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND RESIST REMOVING UNIT
- Publication number 20150270147
- Publication date Sep 24, 2015
- EBARA CORPORATION
- Kenichi KOBAYASHI
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANFSER METHOD
- Publication number 20150270151
- Publication date Sep 24, 2015
- EBARA CORPORATION
- Toshio YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING LIQUID, ETCHING METHOD, AND METHOD OF MANUFACTURING SOLDER...
- Publication number 20150191830
- Publication date Jul 9, 2015
- EBARA CORPORATION
- Akira SUSAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20130056361
- Publication date Mar 7, 2013
- Keiichi KURASHINA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20100219078
- Publication date Sep 2, 2010
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20100163408
- Publication date Jul 1, 2010
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing method and substrate processing apparatus
- Publication number 20090020434
- Publication date Jan 22, 2009
- Akira Susaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating apparatus and electroplating method
- Publication number 20080029398
- Publication date Feb 7, 2008
- Satoru Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20070238265
- Publication date Oct 11, 2007
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating device and planting method
- Publication number 20060113192
- Publication date Jun 1, 2006
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20060086616
- Publication date Apr 27, 2006
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20050241946
- Publication date Nov 3, 2005
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method and plating apparatus
- Publication number 20050139482
- Publication date Jun 30, 2005
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus for substrate
- Publication number 20050077173
- Publication date Apr 14, 2005
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20050061659
- Publication date Mar 24, 2005
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20050051437
- Publication date Mar 10, 2005
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Keiichi Kurashina

Person

Patents Grantslast 30 patents

Substrate processing apparatus

Substrate processing apparatus

Substrate processing apparatus and substrate transfer method

Substrate processing apparatus and method of transferring a substrate

Etching liquid, etching method, and method of manufacturing solder...

Substrate processing apparatus and substrate processing method

Electroplating apparatus and electroplating method

Plating apparatus and plating method

Plating apparatus and plating method

Plating method and plating apparatus

Plating apparatus for substrate

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SUBSTRATE AND THE SAME SUBSTRATE

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANFSER METHOD

SUBSTRATE PROCESSING APPARATUS

ETCHING LIQUID, ETCHING METHOD, AND METHOD OF MANUFACTURING SOLDER...

SUBSTRATE PROCESSING APPARATUS AND RESIST REMOVING UNIT

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANFSER METHOD

ETCHING LIQUID, ETCHING METHOD, AND METHOD OF MANUFACTURING SOLDER...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

PLATING APPARATUS AND PLATING METHOD

Plating apparatus and plating method

Substrate processing method and substrate processing apparatus

Electroplating apparatus and electroplating method

Plating apparatus and plating method

Plating device and planting method

Plating apparatus and plating method

Plating apparatus and plating method

Plating method and plating apparatus

Plating apparatus for substrate

Plating apparatus and plating method

Plating apparatus and plating method