Keiji Miki

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip
- Patent number 8,330,255
- Issue date Dec 11, 2012
- Panasonic Corporation
- Keiji Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer
- Patent number 8,022,508
- Issue date Sep 20, 2011
- Panasonic Corporation
- Keiji Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having recessed connector portions
- Patent number 7,728,429
- Issue date Jun 1, 2010
- Panasonic Corporation
- Isamu Aokura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip-scale-packaging (CSP) having an inductor
- Patent number 7,279,357
- Issue date Oct 9, 2007
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a diffusion layer
- Patent number 6,954,001
- Issue date Oct 11, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an inductor formed on a region of an in...
- Patent number 6,914,331
- Issue date Jul 5, 2005
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a diffusion layer formed between ele...
- Patent number 6,784,557
- Issue date Aug 31, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor chip
- Publication number 20110298096
- Publication date Dec 8, 2011
- PANASONIC CORPORATION
- Keiji Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110278722
- Publication date Nov 17, 2011
- PANASONIC CORPORATION
- Keiji Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110241178
- Publication date Oct 6, 2011
- PANASONIC CORPORATION
- Keiji Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER, METHOD OF MANUFACTURING THE SAME AND METHOD OF...
- Publication number 20080135841
- Publication date Jun 12, 2008
- Matsushita Electric Industrial Co., Ltd.
- Keiji MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080087993
- Publication date Apr 17, 2008
- Matsushita Electric Industrial Co., Ltd.
- Isamu Aokura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20050199979
- Publication date Sep 15, 2005
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050012214
- Publication date Jan 20, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20030218247
- Publication date Nov 27, 2003
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030116867
- Publication date Jun 26, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor chip

Semiconductor wafer

Semiconductor device having recessed connector portions

Method for fabricating a chip-scale-packaging (CSP) having an inductor

Semiconductor device including a diffusion layer

Semiconductor device having an inductor formed on a region of an in...

Semiconductor device including a diffusion layer formed between ele...

Patents Applicationslast 30 patents

Semiconductor chip

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR WAFER, METHOD OF MANUFACTURING THE SAME AND METHOD OF...

Semiconductor device and method of manufacturing the same

Semiconductor device and method for fabricating the same

Semiconductor device and manufacturing method thereof

Semiconductor device and method for fabricating the same

Semiconductor device and manufacturing method thereof