Keiji Saeki

Person

Kadoma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of mounting a semiconductor chip on a wiring substrate
- Patent number 5,813,115
- Issue date Sep 29, 1998
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiko Misawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging electronic chip component and method of bonding...
- Patent number 5,744,382
- Issue date Apr 28, 1998
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Kitayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC component mounting method and apparatus
- Patent number 5,667,129
- Issue date Sep 16, 1997
- Matsushita Electric Industrial Co., Ltd.
- Koichi Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic chip component with passivation film and organic protect...
- Patent number 5,646,439
- Issue date Jul 8, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Kitayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,622,590
- Issue date Apr 22, 1997
- Matsushita Electronics Corporation
- Yoshinobu Kunitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,550,408
- Issue date Aug 27, 1996
- Matsushita Electronics Corporation
- Yoshinobu Kunitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,436,503
- Issue date Jul 25, 1995
- Matsushita Electronics Corporation
- Yoshinobu Kunitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding lead of IC component with electrode
- Patent number 5,240,170
- Issue date Aug 31, 1993
- Matsushita Electric Industrial Co., Ltd.
- Kazuto Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for soldering printed circuit boards
- Patent number 4,824,010
- Issue date Apr 25, 1989
- Matsushita Electric Industrial Co., Ltd.
- Takao Inoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for drawing thick film circuit
- Patent number 4,743,465
- Issue date May 10, 1988
- Matsushita Electric Industrial Co., Ltd.
- Keiji Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for drawing a thick film circuit
- Patent number 4,692,351
- Issue date Sep 8, 1987
- Matsushita Electric Industrial Co., Ltd.
- Yukio Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosetting resin compositions
- Patent number 4,425,209
- Issue date Jan 10, 1984
- Matsushita Electric Industrial Co., Ltd.
- Keiji Saeki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Keiji Saeki

Person

Patents Grantslast 30 patents

Method of mounting a semiconductor chip on a wiring substrate

Method of packaging electronic chip component and method of bonding...

IC component mounting method and apparatus

Electronic chip component with passivation film and organic protect...

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device and method of manufacturing the same

Method for bonding lead of IC component with electrode

Process and apparatus for soldering printed circuit boards

Method and apparatus for drawing thick film circuit

Method and apparatus for drawing a thick film circuit

Photosetting resin compositions