Keiji Shinyama

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Okazaki-city, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having aluminum and metal electrodes and metho...
- Patent number 7,030,496
- Issue date Apr 18, 2006
- Denso Corporation
- Keiji Shinyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device having aluminum electrode and metallic electrode
- Publication number 20060081996
- Publication date Apr 20, 2006
- DENSO CORPORATION
- Keiji Shinyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor sensor and method of plating semiconductor devices
- Publication number 20050034526
- Publication date Feb 17, 2005
- DENSO Corporation
- Keiji Shinyama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device having aluminum and metal electrodes and metho...
- Publication number 20050006778
- Publication date Jan 13, 2005
- DENSO Corporation
- Keiji Shinyama
- H01 - BASIC ELECTRIC ELEMENTS