Kein Fee Liew

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Patents Grantslast 30 patents

Information Patent Grant
Backside mold process for ultra thin substrate and package on packa...
- Patent number 8,835,220
- Issue date Sep 16, 2014
- Intel Corporation
- Huay Huay Sim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Backside mold process for ultra thin substrate and package on packa...
- Patent number 8,384,223
- Issue date Feb 26, 2013
- Intel Corporation
- Huay Huay Sim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKA...
- Publication number 20150072474
- Publication date Mar 12, 2015
- Intel Corporation
- Huay Huay Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKA...
- Publication number 20130230946
- Publication date Sep 5, 2013
- Huay Huay Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKA...
- Publication number 20090321949
- Publication date Dec 31, 2009
- Huay Huay Sim
- H01 - BASIC ELECTRIC ELEMENTS