Keisuke Fukuda

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of semiconductor device protection
- Patent number 8,268,670
- Issue date Sep 18, 2012
- Fujitsu Semiconductor Limited
- Kazuhiro Tashiro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device packaging structure
- Patent number 8,164,181
- Issue date Apr 24, 2012
- Fujitsu Semiconductor Limited
- Kazuhiro Tashiro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of semiconductor device protection, package of semiconductor...
- Patent number 7,807,481
- Issue date Oct 5, 2010
- Fujitsu Semiconductor Limited
- Kazuhiro Tashiro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Contactor for electronic components and test method using the same
- Patent number 7,518,388
- Issue date Apr 14, 2009
- Fujitsu Microelectronics Limited
- Kazuhiro Tashiro
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device protection cover, and semiconductor device uni...
- Patent number 7,382,046
- Issue date Jun 3, 2008
- Fujitsu Limited
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contactor for electronic components and test method using the same
- Patent number 7,309,996
- Issue date Dec 18, 2007
- Fujitsu Limited
- Kazuhiro Tashiro
- G01 - MEASURING TESTING
Information Patent Grant
Contactor having contact electrodes formed by laser processing
- Patent number 6,806,723
- Issue date Oct 19, 2004
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing semiconductor device using heated conveyanc...
- Patent number 6,673,654
- Issue date Jan 6, 2004
- Fujitsu Limited
- Takao Ohno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF SEMICONDUCTOR DEVICE PROTECTION
- Publication number 20120005875
- Publication date Jan 12, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEMICONDUCTOR DEVICE PROTECTION, PACKAGE OF SEMICONDUCTOR...
- Publication number 20110049699
- Publication date Mar 3, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of semiconductor device protection, package of semiconductor...
- Publication number 20080203558
- Publication date Aug 28, 2008
- FUJITSU LIMITED
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contactor for electronic components and test method using the same
- Publication number 20080136433
- Publication date Jun 12, 2008
- Fujitsu Limited
- Kazuhiro Tashiro
- G01 - MEASURING TESTING
Information Patent Application
Suspension-terminal connecting apparatus and method of manufacturin...
- Publication number 20080034580
- Publication date Feb 14, 2008
- FUJITSU LIMITED
- Tetsuo Saito
- G11 - INFORMATION STORAGE
Information Patent Application
Method of semiconductor device protection, package of semiconductor...
- Publication number 20050072972
- Publication date Apr 7, 2005
- FUJITSU LIMITED
- Kazuhiro Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contactor for electronic components and test method using the same
- Publication number 20040239357
- Publication date Dec 2, 2004
- FUJITSU LIMITED
- Kazuhiro Tashiro
- G01 - MEASURING TESTING
Information Patent Application
Contactor having contact electrodes formed by laser processing
- Publication number 20040032272
- Publication date Feb 19, 2004
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Method of manufacturing semiconductor device using heated conveyanc...
- Publication number 20030077879
- Publication date Apr 24, 2003
- FUJITSU LIMITED
- Takao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device from semiconductor waf...
- Publication number 20030073264
- Publication date Apr 17, 2003
- FUJITSU LIMITED
- Koichi Meguro
- H01 - BASIC ELECTRIC ELEMENTS

Keisuke Fukuda

Person

Patents Grantslast 30 patents

Method of semiconductor device protection

Semiconductor device packaging structure

Method of semiconductor device protection, package of semiconductor...

Contactor for electronic components and test method using the same

Semiconductor device protection cover, and semiconductor device uni...

Contactor for electronic components and test method using the same

Contactor having contact electrodes formed by laser processing

Method of manufacturing semiconductor device using heated conveyanc...

Patents Applicationslast 30 patents

METHOD OF SEMICONDUCTOR DEVICE PROTECTION

METHOD OF SEMICONDUCTOR DEVICE PROTECTION, PACKAGE OF SEMICONDUCTOR...

Method of semiconductor device protection, package of semiconductor...

Contactor for electronic components and test method using the same

Suspension-terminal connecting apparatus and method of manufacturin...

Method of semiconductor device protection, package of semiconductor...

Contactor for electronic components and test method using the same

Contactor having contact electrodes formed by laser processing

Method of manufacturing semiconductor device using heated conveyanc...

Method of manufacturing semiconductor device from semiconductor waf...