Keisuke NISHIDO

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Chiyoda-ku, Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method, curable resin compositio...
- Patent number 12,084,599
- Issue date Sep 10, 2024
- Resonac Corporation
- Emi Miyazawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device manufacturing method, curable resin compositio...
- Patent number 11,840,648
- Issue date Dec 12, 2023
- Resonac Corporation
- Emi Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, TEMPORARY-FIXING MAT...
- Publication number 20240395568
- Publication date Nov 28, 2024
- Resonac Corporation
- Keisuke NISHIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...
- Publication number 20240112941
- Publication date Apr 4, 2024
- Masaaki TAKEKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...
- Publication number 20240093059
- Publication date Mar 21, 2024
- Resonac Corporation
- Emi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD AND LAMINATE FILM FOR TEMPOR...
- Publication number 20220028722
- Publication date Jan 27, 2022
- Showa Denko Materials Co., Ltd.
- Emi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...
- Publication number 20200399506
- Publication date Dec 24, 2020
- HITACHI CHEMICAL COMPANY, LTD.
- Emi MIYAZAWA
- B32 - LAYERED PRODUCTS