Keisuke Uenishi

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Suita, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component and electronic device
- Patent number 10,062,658
- Issue date Aug 28, 2018
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic device
- Patent number 10,056,342
- Issue date Aug 21, 2018
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder, soldering method, and semiconductor device
- Patent number 8,673,762
- Issue date Mar 18, 2014
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20150311171
- Publication date Oct 29, 2015
- FUJITSU LIMITED
- Seiki SAKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20130164956
- Publication date Jun 27, 2013
- Fujitsu Limited
- Seiki SAKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE
- Publication number 20120193800
- Publication date Aug 2, 2012
- FUJITSU LIMITED
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR