Keita Yagi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 12,062,563
- Issue date Aug 13, 2024
- Ebara Corporation
- Itsuki Kobata
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing member dressing method
- Patent number 11,945,075
- Issue date Apr 2, 2024
- Ebara Corporation
- Keita Yagi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 11,883,922
- Issue date Jan 30, 2024
- Ebara Corporation
- Yuki Watanabe
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus, method of creating thickness map, an...
- Patent number 11,833,636
- Issue date Dec 5, 2023
- Ebara Corporation
- Katsuhide Watanabe
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 11,759,913
- Issue date Sep 19, 2023
- Ebara Corporation
- Keita Yagi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 11,478,893
- Issue date Oct 25, 2022
- Ebara Corporation
- Keita Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus and polishing member dressing method
- Patent number 11,458,589
- Issue date Oct 4, 2022
- Ebara Corporation
- Keita Yagi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 11,450,544
- Issue date Sep 20, 2022
- Ebara Corporation
- Itsuki Kobata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 11,260,496
- Issue date Mar 1, 2022
- Ebara Corporation
- Keita Yagi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus and method
- Patent number 11,195,729
- Issue date Dec 7, 2021
- Ebara Corporation
- Yuki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flattening method and flattening apparatus
- Patent number 10,916,455
- Issue date Feb 9, 2021
- Ebara Corporation
- Kazuto Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate polishing apparatus and method
- Patent number 10,828,747
- Issue date Nov 10, 2020
- Ebara Corporation
- Yasumasa Hiroo
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, substrate processing system, and su...
- Patent number 10,665,487
- Issue date May 26, 2020
- Ebara Corporation
- Itsuki Kobata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head height adjustment device and substrate processing apparatus pr...
- Patent number 10,556,314
- Issue date Feb 11, 2020
- Ebara Corporation
- Suguru Sakugawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 10,399,203
- Issue date Sep 3, 2019
- Ebara Corporation
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Flattening method and flattening apparatus
- Patent number 10,297,475
- Issue date May 21, 2019
- Ebara Corporation
- Kazuto Yamauchi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polished-state monitoring method
- Patent number 9,999,955
- Issue date Jun 19, 2018
- Ebara Corporation
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing device and polishing method
- Patent number 9,550,269
- Issue date Jan 24, 2017
- Ebara Corporation
- Yoichi Shiokawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 9,390,986
- Issue date Jul 12, 2016
- Ebara Corporation
- Yoichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method, polishing apparatus and GaN wafer
- Patent number 9,233,449
- Issue date Jan 12, 2016
- Osaka University
- Yasuhisa Sano
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method, polishing apparatus and polishing tool
- Patent number 8,912,095
- Issue date Dec 16, 2014
- Osaka University
- Yasuhisa Sano
- B24 - GRINDING POLISHING
Information Patent Grant
Flattening method and flattening apparatus
- Patent number 8,734,661
- Issue date May 27, 2014
- Ebara Corporation
- Kazuto Yamauchi
- B24 - GRINDING POLISHING
Information Patent Grant
Catalyst-aided chemical processing method and apparatus
- Patent number 7,651,625
- Issue date Jan 26, 2010
- Osaka University
- Kazuto Yamauchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FILM THICKNESS MEASUREMENT DEVICE, FILM THICKNESS MEASUREMENT METHO...
- Publication number 20240353344
- Publication date Oct 24, 2024
- EBARA CORPORATION
- Masaki KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CREATING RESPONSIVENESS PROFILE OF POLISHING RATE OF WORK...
- Publication number 20240253181
- Publication date Aug 1, 2024
- EBARA CORPORATION
- Satoru YAMAKI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS, SUBSTRATE PROCESSING APPARATUS, METH...
- Publication number 20240217062
- Publication date Jul 4, 2024
- EBARA CORPORATION
- Masashi KABASAWA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING DEVICE, SUBSTRATE PROCESSING APPARATUS, METHOD,...
- Publication number 20240217060
- Publication date Jul 4, 2024
- EBARA CORPORATION
- Masashi KABASAWA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240208002
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Masaki KINOSHITA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF CREATING RESPONSIVE PROFILE OF POLISHING RATE OF WORKPIEC...
- Publication number 20240198480
- Publication date Jun 20, 2024
- EBARA CORPORATION
- Satoru YAMAKI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD, AND POLISHING APPARATUS
- Publication number 20240181594
- Publication date Jun 6, 2024
- EBARA CORPORATION
- Masashi KABASAWA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20230381919
- Publication date Nov 30, 2023
- EBARA CORPORATION
- Keita Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHING MEMBER DRESSING METHOD
- Publication number 20220410345
- Publication date Dec 29, 2022
- EBARA CORPORATION
- Keita YAGI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...
- Publication number 20220375775
- Publication date Nov 24, 2022
- EBARA CORPORATION
- Itsuki KOBATA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20220371153
- Publication date Nov 24, 2022
- EBARA CORPORATION
- Toshimitsu Sasaki
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF PRODUCING A MODEL FOR ESTIMATING FILM THICKNESS OF WORKPI...
- Publication number 20220316863
- Publication date Oct 6, 2022
- EBARA CORPORATION
- Nachiketa CHAUHAN
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD FOR CONTROLLING DRESSING...
- Publication number 20220048160
- Publication date Feb 17, 2022
- EBARA CORPORATION
- Yasumasa HIROO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD, POLISHING APPARATUS, AND COMPUTER-READABLE STORAG...
- Publication number 20210402550
- Publication date Dec 30, 2021
- EBARA CORPORATION
- Yoichi Shiokawa
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20210170544
- Publication date Jun 10, 2021
- EBARA CORPORATION
- Keita Yagi
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS, METHOD OF CREATING THICKNESS MAP, AN...
- Publication number 20210101250
- Publication date Apr 8, 2021
- EBARA CORPORATION
- Katsuhide Watanabe
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...
- Publication number 20200243364
- Publication date Jul 30, 2020
- EBARA CORPORATION
- Itsuki KOBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHING MEMBER DRESSING METHOD
- Publication number 20200198094
- Publication date Jun 25, 2020
- EBARA CORPORATION
- Keita YAGI
- B24 - GRINDING POLISHING
Information Patent Application
FLATTENING METHOD AND FLATTENING APPARATUS
- Publication number 20190228994
- Publication date Jul 25, 2019
- EBARA CORPORATION
- Kazuto Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20190160626
- Publication date May 30, 2019
- EBARA CORPORATION
- Yuki WATANABE
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20190134774
- Publication date May 9, 2019
- EBARA CORPORATION
- Keita YAGI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20190118333
- Publication date Apr 25, 2019
- EBARA CORPORATION
- Keita YAGI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND METHOD
- Publication number 20190047117
- Publication date Feb 14, 2019
- EBARA CORPORATION
- Yuki WATANABE
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND METHOD
- Publication number 20190027382
- Publication date Jan 24, 2019
- EBARA CORPORATION
- Yuki WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POLISHING APPARATUS AND METHOD
- Publication number 20190009385
- Publication date Jan 10, 2019
- EBARA CORPORATION
- Yasumasa HIROO
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND SUB...
- Publication number 20180211849
- Publication date Jul 26, 2018
- EBARA CORPORATION
- Itsuki KOBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAD HEIGHT ADJUSTMENT DEVICE AND SUBSTRATE PROCESSING APPARATUS PR...
- Publication number 20180001438
- Publication date Jan 4, 2018
- EBARA CORPORATION
- Suguru SAKUGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20170352573
- Publication date Dec 7, 2017
- EBARA CORPORATION
- Zhongxin WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20170190020
- Publication date Jul 6, 2017
- EBARA CORPORATION
- Yoichi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM. AND SU...
- Publication number 20170047237
- Publication date Feb 16, 2017
- EBARA CORPORATION
- Itsuki KOBATA
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Substrate processing apparatus, substrate processing system, and su...

Polishing apparatus and polishing member dressing method

Substrate processing apparatus

Substrate polishing apparatus, method of creating thickness map, an...

Polishing method and polishing apparatus

Polishing method and polishing apparatus

Polishing apparatus and polishing member dressing method

Substrate processing apparatus, substrate processing system, and su...

Polishing method and polishing apparatus

Substrate polishing apparatus and method

Flattening method and flattening apparatus

Substrate polishing apparatus and method

Substrate processing apparatus, substrate processing system, and su...

Head height adjustment device and substrate processing apparatus pr...

Polishing method and polishing apparatus

Flattening method and flattening apparatus

Polishing apparatus and polished-state monitoring method

Polishing device and polishing method

Polishing apparatus and polishing method

Polishing method, polishing apparatus and GaN wafer

Polishing method, polishing apparatus and polishing tool

Flattening method and flattening apparatus

Catalyst-aided chemical processing method and apparatus

Patents Applicationslast 30 patents

FILM THICKNESS MEASUREMENT DEVICE, FILM THICKNESS MEASUREMENT METHO...

METHOD OF CREATING RESPONSIVENESS PROFILE OF POLISHING RATE OF WORK...

SUBSTRATE POLISHING APPARATUS, SUBSTRATE PROCESSING APPARATUS, METH...

SUBSTRATE POLISHING DEVICE, SUBSTRATE PROCESSING APPARATUS, METHOD,...

POLISHING APPARATUS AND POLISHING METHOD

METHOD OF CREATING RESPONSIVE PROFILE OF POLISHING RATE OF WORKPIEC...

POLISHING METHOD, AND POLISHING APPARATUS

POLISHING METHOD AND POLISHING APPARATUS

POLISHING APPARATUS AND POLISHING MEMBER DRESSING METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...

POLISHING APPARATUS AND POLISHING METHOD

METHOD OF PRODUCING A MODEL FOR ESTIMATING FILM THICKNESS OF WORKPI...

SUBSTRATE PROCESSING APPARATUS AND METHOD FOR CONTROLLING DRESSING...

POLISHING METHOD, POLISHING APPARATUS, AND COMPUTER-READABLE STORAG...

POLISHING METHOD AND POLISHING APPARATUS

SUBSTRATE POLISHING APPARATUS, METHOD OF CREATING THICKNESS MAP, AN...

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SU...

POLISHING APPARATUS AND POLISHING MEMBER DRESSING METHOD

FLATTENING METHOD AND FLATTENING APPARATUS

SUBSTRATE PROCESSING APPARATUS

POLISHING METHOD AND POLISHING APPARATUS

POLISHING METHOD AND POLISHING APPARATUS

SUBSTRATE POLISHING APPARATUS AND METHOD

SUBSTRATE POLISHING APPARATUS AND METHOD

SUBSTRATE POLISHING APPARATUS AND METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND SUB...

HEAD HEIGHT ADJUSTMENT DEVICE AND SUBSTRATE PROCESSING APPARATUS PR...

SUBSTRATE PROCESSING APPARATUS

POLISHING METHOD AND POLISHING APPARATUS

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM. AND SU...