Keith C. Stevens

Person

Fairfield, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Signal monitoring of through-wafer vias using a multi-layer inductor
- Patent number 9,658,255
- Issue date May 23, 2017
- International Business Machines Corporation
- Mark A. DiRocco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal monitoring of through-wafer vias using a multi-layer inductor
- Patent number 9,372,208
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Mark A. DiRocco
- G01 - MEASURING TESTING
Information Patent Grant
Low-voltage IC test for defect screening
- Patent number 9,285,417
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Inc.
- Daniel J. Poindexter
- G01 - MEASURING TESTING
Information Patent Grant
Methodologies and test configurations for testing thermal interface...
- Patent number 9,116,200
- Issue date Aug 25, 2015
- International Business Machines Corporation
- Dustin Fregeau
- G01 - MEASURING TESTING
Information Patent Grant
Methodologies and test configurations for testing thermal interface...
- Patent number 8,471,575
- Issue date Jun 25, 2013
- International Business Machines Corporation
- Dustin Fregeau
- G01 - MEASURING TESTING
Information Patent Grant
Light controlled silicon on insulator device
- Patent number 6,545,333
- Issue date Apr 8, 2003
- International Business Machines Corporation
- Mark B. Ketchen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for monitoring defects in polysilicon gates in semiconductor...
- Patent number 6,529,018
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Keith C. Stevens
- G01 - MEASURING TESTING
Information Patent Grant
Reduction of induced charge in SOI devices during focused ion beam...
- Patent number 6,458,634
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Keith C. Stevens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device under test temperature control fixture
- Patent number 6,191,599
- Issue date Feb 20, 2001
- International Business Machines Corporation
- Keith C. Stevens
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL MONITORING OF THROUGH-WAFER VIAS USING A MULTI-LAYER INDUCTOR
- Publication number 20150362534
- Publication date Dec 17, 2015
- International Business Machines Corporation
- Mark A. DiRocco
- G01 - MEASURING TESTING
Information Patent Application
SIGNAL MONITORING OF THROUGH-WAFER VIAS USING A MULTI-LAYER INDUCTOR
- Publication number 20150185273
- Publication date Jul 2, 2015
- International Business Machines Corporation
- Mark A. DiRocco
- G01 - MEASURING TESTING
Information Patent Application
LOW-VOLTAGE IC TEST FOR DEFECT SCREENING
- Publication number 20140184262
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Daniel J. Poindexter
- G01 - MEASURING TESTING
Information Patent Application
METHODOLOGIES AND TEST CONFIGURATIONS FOR TESTING THERMAL INTERFACE...
- Publication number 20130229198
- Publication date Sep 5, 2013
- International Business Machines Corporation
- Dustin FREGEAU
- G01 - MEASURING TESTING
Information Patent Application
Methodologies and Test Configurations for Testing Thermal Interface...
- Publication number 20110267082
- Publication date Nov 3, 2011
- International Business Machines Corporation
- Dustin FREGEAU
- G01 - MEASURING TESTING
Information Patent Application
DEPOSITION OF CONDUCTIVE MATERIAL OVER A SEMICONDUCTOR STRUCTURE TH...
- Publication number 20020155645
- Publication date Oct 24, 2002
- Keith C. Stevens
- H01 - BASIC ELECTRIC ELEMENTS

Keith C. Stevens

Person

Patents Grantslast 30 patents

Signal monitoring of through-wafer vias using a multi-layer inductor

Signal monitoring of through-wafer vias using a multi-layer inductor

Low-voltage IC test for defect screening

Methodologies and test configurations for testing thermal interface...

Methodologies and test configurations for testing thermal interface...

Light controlled silicon on insulator device

Method for monitoring defects in polysilicon gates in semiconductor...

Reduction of induced charge in SOI devices during focused ion beam...

IC device under test temperature control fixture

Patents Applicationslast 30 patents

SIGNAL MONITORING OF THROUGH-WAFER VIAS USING A MULTI-LAYER INDUCTOR

SIGNAL MONITORING OF THROUGH-WAFER VIAS USING A MULTI-LAYER INDUCTOR

LOW-VOLTAGE IC TEST FOR DEFECT SCREENING

METHODOLOGIES AND TEST CONFIGURATIONS FOR TESTING THERMAL INTERFACE...

Methodologies and Test Configurations for Testing Thermal Interface...

DEPOSITION OF CONDUCTIVE MATERIAL OVER A SEMICONDUCTOR STRUCTURE TH...