Keith K. Sturcken

Person

Manassas, VA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hermetically sealed electronics module with enhanced cooling of cor...
- Patent number 11,894,286
- Issue date Feb 6, 2024
- BAE Systems Information and Electronic Systems Integration Inc.
- Keith K Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module hybrid integrated circuit with multiple power zon...
- Patent number 10,854,586
- Issue date Dec 1, 2020
- BAE Systems Information and Electronics Systems Integration Inc.
- Lori D. Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for high-power microwave module
- Patent number 9,859,178
- Issue date Jan 2, 2018
- BAE Systems Information and Electronic Systems Integration Inc.
- Yannick C. Morel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for cooling electonic components
- Patent number 9,502,269
- Issue date Nov 22, 2016
- BAE Systems Information and Electronic Systems Integration Inc.
- Alan M. Berard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating solder columns for a column grid array package
- Patent number 8,723,323
- Issue date May 13, 2014
- BAE Systems Information and Electronic Systems Integration Inc.
- Thomas J. McIntyre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods for stacking individually tested devices to for...
- Patent number 8,697,457
- Issue date Apr 15, 2014
- BAE Systems Information and Electronic Systems Integration Inc.
- Keith K. Sturcken
- G01 - MEASURING TESTING
Information Patent Grant
Isostress grid array and method of fabrication thereof
- Patent number 8,586,417
- Issue date Nov 19, 2013
- BAE Systems Information and Electronic Systems Integration Inc.
- John A. Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isostress grid array and method of fabrication thereof
- Patent number 8,519,527
- Issue date Aug 27, 2013
- BAE Systems Information and Electronic Systems Integration Inc.
- John A. Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for providing thermal management on high-power...
- Patent number 7,491,577
- Issue date Feb 17, 2009
- BAE Systems Information and Electronic Systems Integration Inc.
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable resistance memory element with indirect heating
- Patent number 6,969,869
- Issue date Nov 29, 2005
- Ovonyx, Inc.
- Steve Hudgens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Article comprising a multi-layer electronic package and method ther...
- Patent number 6,734,538
- Issue date May 11, 2004
- BAE Systems Information and Electronic Systems Integration, Inc.
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a programmable chalcogenide fuse within a...
- Patent number 6,692,994
- Issue date Feb 17, 2004
- BAE Systems, Information and Electronic Systems Integration, Inc.
- John D. Davis
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for forming a micro column grid array (CGA)
- Patent number 6,547,124
- Issue date Apr 15, 2003
- BAE Systems Information and Electronic Systems Integration Inc.
- Tushar T. Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insitu radiation protection of integrated circuits
- Patent number 6,544,879
- Issue date Apr 8, 2003
- Bae Systems Information & Electronic Systems Integration Inc.
- Tushar T. Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insitu radiation protection of integrated circuits
- Patent number 6,504,256
- Issue date Jan 7, 2003
- BAE Systems Information and Electronic Systems Integration, Inc.
- Tushar T. Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array (BGA) to column grid array (CGA) conversion process
- Patent number 6,492,254
- Issue date Dec 10, 2002
- BAE Systems Information and Electronic Systems Integration, Inc.
- Keith K. Sturcken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Programmable chalcogenide fuse within a semiconductor device
- Patent number 6,448,576
- Issue date Sep 10, 2002
- BAE Systems Information and Electronic Systems Integration, Inc.
- John D. Davis
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit package
- Patent number 6,329,594
- Issue date Dec 11, 2001
- BAE Systems Information and Electronic Systems Integration, Inc.
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HERMETICALLY SEALED ELECTRONICS MODULE WITH ENHANCED COOLING OF COR...
- Publication number 20220051966
- Publication date Feb 17, 2022
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE HYBRID INTEGRATED CIRCUIT WITH MULTIPLE POWER ZON...
- Publication number 20200373286
- Publication date Nov 26, 2020
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Lori D. Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING FOR HIGH-POWER MICROWAVE MODULE
- Publication number 20160100495
- Publication date Apr 7, 2016
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- YANNICK C. MOREL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR COOLING ELECTONIC COMPONENTS
- Publication number 20150289414
- Publication date Oct 8, 2015
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- ALAN M. BERARD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING SOLDER COLUMNS FOR A COLUMN GRID ARRAY PACKAGE
- Publication number 20140206153
- Publication date Jul 24, 2014
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- THOMAS J. McINTYRE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES AND METHODS FOR STACKING INDIVIDUALLY TESTED DEVICES TO FOR...
- Publication number 20140175675
- Publication date Jun 26, 2014
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Keith K. Sturcken
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING SOLDER COLUMNS FOR A COLUMN GRID ARRAY PACKAGE
- Publication number 20140015098
- Publication date Jan 16, 2014
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- THOMAS J. McINTYRE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ISOSTRESS GRID ARRAY AND METHOD OF FABRICATION THEREOF
- Publication number 20130309815
- Publication date Nov 21, 2013
- BAE Systems Information And Electronic Systems Intergration Inc.
- John A. Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isostress grid array and method of fabrication thereof
- Publication number 20110074009
- Publication date Mar 31, 2011
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- John A. Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Providing Thermal Management on High-Power...
- Publication number 20080164603
- Publication date Jul 10, 2008
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for stacking chips within a multichip module package
- Publication number 20050078436
- Publication date Apr 14, 2005
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable resistance memory element with indirect heating
- Publication number 20040140523
- Publication date Jul 22, 2004
- Steve Hudgens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for stacking chips within a multichip module package
- Publication number 20030178715
- Publication date Sep 25, 2003
- BAE Systems
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a programmable chalcogenide fuse within a...
- Publication number 20030045034
- Publication date Mar 6, 2003
- BAE SYSTEMS, Information and Electronic Systems Integration, Inc.
- John D. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insitu radiation protection of integrated circuits
- Publication number 20020195719
- Publication date Dec 26, 2002
- BAE SYSTEMS Information and Electronic Systems Integration, Inc
- Tushar K. Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a micro column grid array (CGA)
- Publication number 20020190107
- Publication date Dec 19, 2002
- BAE SYSTEMS Information and Electronic Systems Integration, Inc
- Tushar T. Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array (BGA) to column grid array (CGA) conversion process
- Publication number 20020102767
- Publication date Aug 1, 2002
- Keith K. Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insitu radiation protection of integrated circuits
- Publication number 20020100985
- Publication date Aug 1, 2002
- BAE SYSTEMS Information and Electronic Systems Integration, Inc
- Tushar T. Shah
- H01 - BASIC ELECTRIC ELEMENTS

Keith K. Sturcken

Person

Patents Grantslast 30 patents

Hermetically sealed electronics module with enhanced cooling of cor...

Multi-chip module hybrid integrated circuit with multiple power zon...

Packaging for high-power microwave module

Method and apparatus for cooling electonic components

Method for fabricating solder columns for a column grid array package

Devices and methods for stacking individually tested devices to for...

Isostress grid array and method of fabrication thereof

Isostress grid array and method of fabrication thereof

Method and apparatus for providing thermal management on high-power...

Programmable resistance memory element with indirect heating

Article comprising a multi-layer electronic package and method ther...

Method for manufacturing a programmable chalcogenide fuse within a...

Method for forming a micro column grid array (CGA)

Insitu radiation protection of integrated circuits

Insitu radiation protection of integrated circuits

Ball grid array (BGA) to column grid array (CGA) conversion process

Programmable chalcogenide fuse within a semiconductor device

Integrated circuit package

Patents Applicationslast 30 patents

HERMETICALLY SEALED ELECTRONICS MODULE WITH ENHANCED COOLING OF COR...

MULTI-CHIP MODULE HYBRID INTEGRATED CIRCUIT WITH MULTIPLE POWER ZON...

PACKAGING FOR HIGH-POWER MICROWAVE MODULE

METHOD AND APPARATUS FOR COOLING ELECTONIC COMPONENTS

METHOD FOR FABRICATING SOLDER COLUMNS FOR A COLUMN GRID ARRAY PACKAGE

DEVICES AND METHODS FOR STACKING INDIVIDUALLY TESTED DEVICES TO FOR...

METHOD FOR FABRICATING SOLDER COLUMNS FOR A COLUMN GRID ARRAY PACKAGE

ISOSTRESS GRID ARRAY AND METHOD OF FABRICATION THEREOF

Isostress grid array and method of fabrication thereof

Method and Apparatus for Providing Thermal Management on High-Power...

Method for stacking chips within a multichip module package

Programmable resistance memory element with indirect heating

Method for stacking chips within a multichip module package

Method for manufacturing a programmable chalcogenide fuse within a...

Insitu radiation protection of integrated circuits

Method for forming a micro column grid array (CGA)

Ball grid array (BGA) to column grid array (CGA) conversion process

Insitu radiation protection of integrated circuits